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Transferring an antenna to an RFID inlay substrate

  • US 9,027,227 B2
  • Filed: 10/24/2013
  • Issued: 05/12/2015
  • Est. Priority Date: 11/09/2009
  • Status: Active Grant
First Claim
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1. A method of making a transponder comprising an inlay substrate, an RFID chip and an antenna structure, characterized by:

  • forming a wide trench in the inlay substrate for accepting the antenna structure; and

    after forming the trench, disposing the antenna structure in the trench;

    wherein;

    the transponder is located at one of a plurality of transponder sites on the inlay substrate; and

    further comprising;

    preparing a plurality of transponder sites on an inlay substrate, each transponder site comprising a defined area of the inlay substrate;

    forming a plurality of antenna structures on an antenna substrate which is separate from the inlay substrate; and

    removing given antenna structures from the antenna substrate and transferring them to selected ones of the transponder sites.

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