Integrated microelectronic package temperature sensor
First Claim
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1. A microelectronic component comprising:
- an integrated circuit substrate;
a microelectronic element on said substrate;
a pair of carbon nanotubes supported on said element; and
a temperature sensor on said substrate, said substrate electrically coupled to said nanotubes, said sensor to use varying resistance of said nanotubes to develop a temperature indication.
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Abstract
Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.
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Citations
10 Claims
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1. A microelectronic component comprising:
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an integrated circuit substrate; a microelectronic element on said substrate; a pair of carbon nanotubes supported on said element; and a temperature sensor on said substrate, said substrate electrically coupled to said nanotubes, said sensor to use varying resistance of said nanotubes to develop a temperature indication. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification