Integrated microelectronic package temperature sensor

• US 9,028,142 B2
• Filed: 04/16/2012
• Issued: 05/12/2015
• Est. Priority Date: 06/29/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Raravikar, Nachiket R., Patel, Neha
• Primary Examiner(s): Jagan, Mirellys
• Application Number:
  US13/447,469
• Publication Number:
  US 20120199830A1
• Time in Patent Office: 1,121 Days
• Field of Search: 374/183, 374/141, 374/112, 374/166, 977/955
• US Class Current: 374/183
• CPC Class Codes: B82Y 15/00 Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
• CPC Class Codes: G01K 2211/00 Thermometers based on nanotechnology
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: Y10S 977/955 Of thermal property
• CPC Class Codes: Y10T 428/2918 including free carbon or carbide or therewith [not as steel]

Abstract

Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.

Claims

1. A microelectronic component comprising:

an integrated circuit substrate;

a microelectronic element on said substrate;

a pair of carbon nanotubes supported on said element; and

a temperature sensor on said substrate, said substrate electrically coupled to said nanotubes, said sensor to use varying resistance of said nanotubes to develop a temperature indication.

2. The component of claim 1 wherein said component is a first level interconnect.

3. The component of claim 1 wherein said component is a second level interconnect.

4. The component of claim 1 wherein said component is part of an integrated circuit package.

5. The component of claim 1 wherein said component is a first level interconnect and is coupled to a second level interconnect.

6. The component of claim 1 wherein said carbon nanotubes extend between a pair of metallic structures.

7. The component of claim 1 wherein said component is an integrated circuit die.

8. The component of claim 7 including carbon nanotubes on opposite sides of said die.

9. The component of claim 1 wherein said carbon nanotubes are mounted on a substrate secured to said component.

10. The component of claim 9 wherein said carbon nanotubes are glued to said component.