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Front referenced anode

  • US 9,028,657 B2
  • Filed: 09/10/2010
  • Issued: 05/12/2015
  • Est. Priority Date: 09/10/2010
  • Status: Active Grant
First Claim
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1. An electroplating apparatus, comprising:

  • (a) a work piece holder configured to hold a semiconductor wafer in place during electroplating;

    (b) an anode support comprising an anode positioning mechanism configured for continuously adjusting the position of a consumable anode to provide a consistent distance between the consumable anode and the semiconductor wafer over a period of time during which the consumable anode is consumed;

    (c) the consumable anode, wherein the consumable anode comprises a substantially planar surface that is substantially parallel to the plating surface of the semiconductor wafer during plating, wherein the substantially planar surface is at least co-extensive with the plating surface of the semiconductor wafer; and

    (d) a hard stop in contact with the consumable anode.

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