Microfluidic devices having a reduced number of input and output connections

• US 9,028,773 B2
• Filed: 03/28/2014
• Issued: 05/12/2015
• Est. Priority Date: 09/12/2001
• Status: Expired due to Term

• Current Assignee: HandyLab Incorporated (Becton, Dickinson & Co)
• Original Assignee: HandyLab Incorporated (Becton, Dickinson & Co)
• Inventors: Ganesan, Karthik
• Primary Examiner(s): SIEFKE, SAMUEL P
• Application Number:
  US14/229,188
• Publication Number:
  US 20140297047A1
• Time in Patent Office: 410 Days
• Field of Search: 422/500, 422/503
• US Class Current: 422/500
• CPC Class Codes: B01L 2200/02 Adapting objects or devices to another
• CPC Class Codes: B01L 2200/14 Process control and prevention of errors
• CPC Class Codes: B01L 2200/147 Employing temperature sensors
• CPC Class Codes: B01L 2300/02 Identification, exchange or storage of information
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 2400/0442 thermal energy, e.g. vaporisation, bubble jet
• CPC Class Codes: B01L 2400/0677 phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B01L 3/502746 characterised by the means for controlling flow resistance, e.g. flow controllers, baffles B01L3/502738 takes precedence
• CPC Class Codes: B01L 7/00 Heating or cooling apparatus autoclaves B01J3/04; Heat insulating devices
• CPC Class Codes: G05D 7/0617 specially adapted for fluid materials
• CPC Class Codes: Y10T 137/0318 Processes
• CPC Class Codes: Y10T 436/12 Condition responsive control
• CPC Class Codes: Y10T 436/2575 Volumetric liquid transfer

Abstract

A system and method for reducing the number of input/output connections required to connect a microfluidic substrate to an external controller for controlling the substrate. In one example, a microfluidic processing device is fabricated on a substrate having a plurality of N independently controllable components, (e.g., a resistive heating elements) each having at least two terminals. The substrate includes a plurality of input/output contacts for connecting the substrate to an external controller, and a plurality of leads for connecting the contacts to the terminals of the components. The leads are arranged to allow the external controller to supply control signals to the terminals of the components via the contacts using substantially fewer contacts than the total number of component terminals. For example, in one embodiment, each lead connects a corresponding contact to a plurality of terminals to allow the controller to supply to signals to the terminals without requiring a separate contact for each terminal. However, to assure that the components can each be controlled independently of the others, the leads are also arranged so that each component'"'"'s terminals are connected to a unique combination of contacts. Thus, the external controller can activate a selected component by supplying control signals to the combination of contacts uniquely associated with that component.

Claims

1. A microfluidic processing system comprising:

a control board;

a plurality of analog multiplexors positioned on the control board, the multiplexors having one or more input terminals;

a plurality of independently controllable resistive heating elements; and

a plurality of leads for electrically connecting the multiplexors on the control board to the heating elements, wherein the number of leads is greater than the number of multiplexor input terminals.

2. The system of claim 1, wherein the number of resistive heating elements is greater than the number of multiplexor input terminals.

3. The system of claim 1, further comprising one more or heater drivers in electrical communication with the multiplexors.

4. The system of claim 2, wherein the number of heater drivers is less than the number of multiplexors.

5. The system of claim 2, further comprising a microprocessor for controlling the operation of the heater drivers.

6. The system of claim 1, further comprising a microfluidic substrate in thermal communication with the heating elements.

7. The system of claim 6, wherein the microfluidic substrate comprises a plurality of microfluidic valves.

8. The system of claim 6, wherein the microfluidic substrate comprises a plurality of reaction chambers.

9. The system of claim 1, wherein each heating elements has at least two terminals.

10. The system of claim 9, wherein the leads from the multiplexors on the control board are electrically connected to the terminals of the heating elements.

11. The system of claim 1, further comprising a plurality of independently controllable sensing resistors adjacent to the heating elements.

12. The system of claim 11, wherein the plurality of leads electrically connect the multiplexors to the sensing resistors.

13. The system of claim 11, further comprising one or more sensor drivers in electrical communication with the multiplexors.

14. A microfluidic processing system comprising:

a control board;

a plurality of analog multiplexors positioned on the control board, the multiplexors having one or more input terminals;

a plurality of resistive heating elements positioned on the control board;

a plurality of sensing resistors positioned on the control board; and

a plurality of leads for electrically connecting the multiplexors on the control board to the heating elements, wherein the number of leads is greater than the number of multiplexor input terminals.

15. The system of claim 14, wherein the leads electrically connect the multiplexors on the control board to the sensing resistors.

16. The system of claim 14, further comprising one more or heater drivers in electrical communication with the multiplexors and one or more sensor drivers in electrical communication with the multiplexors.

17. The system of claim 14, further comprising a microfluidic substrate in thermal communication with the heating elements.

18. The system of claim 17, wherein the microfluidic substrate comprises a plurality of microfluidic valves.

19. The system of claim 17, wherein the microfluidic substrate comprises a plurality of reaction chambers.

20. The system of claim 17, wherein the microfluidic substrate is mounted on the control board.