Organic electroluminescence element
First Claim
1. An organic light-emitting element, comprising:
- an anode;
a cathode;
banks;
a functional layer between the anode and the cathode, the functional layer including one or more sublayers, the one or more sublayers including a light-emitting sublayer, the light-emitting sublayer defined by the banks and containing an organic material; and
a hole injection layer between the anode and the functional layer, whereinthe hole injection layer comprises tungsten oxide,the hole injection layer includes an occupied energy level that is approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest energy level of a valence band of the hole injection layer in terms of a binding energy,the hole injection layer has a surface facing the functional layer and has a recessed structure such that a portion of the surface overlapping with the light-emitting sublayer is located closer to the anode than other portions of the surface overlapping with the banks,the portion of the surface overlapping with the light-emitting sublayer and the other portions of the surface overlapping with the banks are located closer to the anode than a peripheral bottom surface of each of the banks,the recessed structure comprises an inner surface that is in contact with the functional layer, the inner surface including an inner bottom surface and an inner side surface that is continuous with the inner bottom surface, anda film thickness of the light-emitting sublayer is uniform over the recessed structure.
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Accused Products
Abstract
An organic light-emitting element comprising: an anode; a cathode; banks; a functional layer between the anode and the cathode; and a hole injection layer between the anode and the functional layer. The functional layer includes one or more sublayers including a light-emitting sublayer defined by the banks and that contains an organic material. The hole injection layer comprises tungsten oxide, includes an occupied energy level that is approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest energy level of a valence band of the hole injection layer in terms of a binding energy, has a surface facing the functional layer, and has a recessed structure such that a portion of the surface overlapping with the light-emitting sublayer is located closer to the anode than other portions. The recessed structure has a recessed portion whose inner surface is in contact with the functional layer.
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Citations
19 Claims
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1. An organic light-emitting element, comprising:
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an anode; a cathode; banks; a functional layer between the anode and the cathode, the functional layer including one or more sublayers, the one or more sublayers including a light-emitting sublayer, the light-emitting sublayer defined by the banks and containing an organic material; and a hole injection layer between the anode and the functional layer, wherein the hole injection layer comprises tungsten oxide, the hole injection layer includes an occupied energy level that is approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest energy level of a valence band of the hole injection layer in terms of a binding energy, the hole injection layer has a surface facing the functional layer and has a recessed structure such that a portion of the surface overlapping with the light-emitting sublayer is located closer to the anode than other portions of the surface overlapping with the banks, the portion of the surface overlapping with the light-emitting sublayer and the other portions of the surface overlapping with the banks are located closer to the anode than a peripheral bottom surface of each of the banks, the recessed structure comprises an inner surface that is in contact with the functional layer, the inner surface including an inner bottom surface and an inner side surface that is continuous with the inner bottom surface, and a film thickness of the light-emitting sublayer is uniform over the recessed structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 16, 17, 18, 19)
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12. A manufacturing method for an organic light-emitting element, comprising:
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preparing an anode; forming a tungsten oxide layer above the anode by introducing a gas comprising an argon gas and an oxygen gas to a chamber of a sputtering device, a total pressure of the gas in the chamber being greater than approximately 2.7 pascals and at most equal to approximately 7.0 pascals, a partial pressure ratio of the oxygen gas with respect to the total pressure of the gas in the chamber being at least approximately 50% and at most approximately 70%, and an input power density per unit surface area of a sputtering target being at least approximately 1 W/cm2 and at most approximately 2.8 W/cm2; forming banks above the tungsten oxide layer by forming a resist film including resist material above the tungsten oxide layer and etching the resist film with a developing solution; forming a hole injection layer, subsequent to forming the banks, by; cleaning, with a cleaning fluid, a surface of the tungsten oxide layer and thereby removing residuals of the resist film adhering to the surface of the tungsten oxide layer; and dissolving a part of the tungsten oxide layer with the cleaning fluid, the hole injection layer formed such that a portion of an upper surface of the hole injection layer facing the functional layer is located closer to the anode than other portions of the upper surface overlapping with the banks, the portion forming a recessed structure comprising an inner surface that is in contact with the functional layer, the inner surface including an inner bottom surface and an inner side surface that is continuous with the inner bottom surface; forming a functional layer by depositing ink into a region of the hole injection layer defined by the banks, applying the ink with respect to the inner bottom surface and the inner side surface such that the ink is in contact with the inner bottom surface and the inner side surface, and drying the ink; and forming a cathode above the functional layer, wherein the portion of the surface facing the functional layer and the other portions of the surface overlapping with the banks are located closer to the anode than a peripheral bottom surface of each of the banks. - View Dependent Claims (14, 15)
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13. A manufacturing method for an organic light-emitting element, comprising:
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preparing an anode; forming a tungsten oxide layer above the anode by introducing a gas comprising an argon gas and an oxygen gas to a chamber of a sputtering device, a total pressure of the gas in the chamber being greater than approximately 2.7 pascals and at most equal to approximately 7.0 pascals, a partial pressure ratio of the oxygen gas with respect to the total pressure of the gas in the chamber being at least approximately 50% and at most approximately 70%, and an input power density per unit surface area of a sputtering target being at least approximately 1 W/cm2 and at most approximately 2.8 W/cm2; forming a hole injection layer, while forming banks above the tungsten oxide layer by forming a resist film including resist material above the tungsten oxide layer and etching the resist film with a developing solution, by; cleaning, with the developing solution, a surface of the tungsten oxide layer and thereby removing residuals of the resist film adhering to the surface of the tungsten oxide layer; and dissolving a part of the tungsten oxide layer with the developing solution, the hole injection layer formed such that a portion of an upper surface of the hole injection layer facing the functional layer is located closer to the anode than other portions of the upper surface overlapping with the banks, the portion forming a recessed structure comprising an inner surface that is in contact with the functional layer, the inner surface including an inner bottom surface and an inner side surface that is continuous with the inner bottom surface; forming a functional layer by depositing ink into a region of the hole injection layer defined by the banks, applying the ink with respect to the inner bottom surface and the inner side surface such that the ink is in contact with the inner bottom surface and the inner side surface, and drying the ink; and forming a cathode above the functional layer, wherein the portion of the surface facing the functional layer and the other portions of the surface overlapping with the banks are located closer to the anode than a peripheral bottom surface of each of the banks.
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Specification