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Light emitting diode package and method of manufacturing the same

  • US 9,029,903 B2
  • Filed: 06/10/2013
  • Issued: 05/12/2015
  • Est. Priority Date: 02/23/2006
  • Status: Active Grant
First Claim
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1. A light emitting diode package comprising:

  • a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions;

    a plurality of electrodes on the package body;

    a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes;

    a phosphor disposed on the plurality of LED chips; and

    a plurality of wires electrically connected to the plurality of LED chips in common,wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion, andwherein the bottom portion exposed through the recess portion is disposed between the at least two protrusion portions.

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