Light emitting diode package and method of manufacturing the same
First Claim
1. A light emitting diode package comprising:
- a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions;
a plurality of electrodes on the package body;
a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes;
a phosphor disposed on the plurality of LED chips; and
a plurality of wires electrically connected to the plurality of LED chips in common,wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion, andwherein the bottom portion exposed through the recess portion is disposed between the at least two protrusion portions.
2 Assignments
0 Petitions
Accused Products
Abstract
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.
-
Citations
23 Claims
-
1. A light emitting diode package comprising:
-
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions; a plurality of electrodes on the package body; a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes; a phosphor disposed on the plurality of LED chips; and a plurality of wires electrically connected to the plurality of LED chips in common, wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion, and wherein the bottom portion exposed through the recess portion is disposed between the at least two protrusion portions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 16, 17, 18, 19, 20, 21, 22, 23)
-
-
10. A light emitting diode package comprising:
-
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions; a plurality of electrodes on the package body; a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes; and a plurality of wires electrically connected to the plurality of LED chips in common, wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion, wherein the bottom portion of the at least one of the plurality of electrodes is substantially flush with a bottom surface of the package body, and wherein the bottom portion of the at least one of the plurality of electrodes exposed through the recess portion is surrounded by the package body. - View Dependent Claims (11, 12)
-
-
13. A light emitting diode package comprising:
-
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions; a plurality of electrodes on the package body; a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes; and a plurality of wires electrically connected to the plurality of LED chips, wherein at least one of the plurality of electrodes is exposed through the recess portion, wherein a bottom portion of the at least one of the plurality of electrodes is exposed through the recess portion, wherein a side surface of the cavity is formed so as to lean outward at a 105-120 degree angle, and wherein the bottom portion exposed through the recess portion is disposed at a center of the package body. - View Dependent Claims (14, 15)
-
Specification