Molded cavity substrate MEMS package fabrication method and structure

• US 9,029,962 B1
• Filed: 10/12/2011
• Issued: 05/12/2015
• Est. Priority Date: 10/12/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Dreiza, Mahmoud, Ballantine, Andrew, Shumway, Russell Scott
• Primary Examiner(s): Harrison, Monica D
• Application Number:
  US13/272,096
• Time in Patent Office: 1,308 Days
• Field of Search: 257/416, 257/678, 257/692, 257/E23.002
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: H01L 2224/05014 being square
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48111 the wire connector extending above another semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/04 : the substrate being a semiconductor body
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively simple and low cost process, the molded ring and thus molded cavity are formed at a minimal cost. This, in turn, minimizes the cost of the molded cavity substrate MEMS package.

Claims

1. An electronic component package comprising:

a Micro Electro Mechanical Systems (MEMS) electronic component;

a first substrate; and

a molded ring coupled to the first substrate, the molded ring comprising a molded cavity, the MEMS electronic component being located within the molded cavity, wherein;

the first substrate comprises inner terminals; and

the electronic component package further comprising electrically conductive through vias coupled to the inner terminals and extending through the molded ring.

2. The electronic component package of claim 1 further comprising a second substrate coupled to the molded ring, the MEMS electronic component coupled to the second substrate.

3. The electronic component package of claim 2 further comprising a base assembly port extending through the second substrate.

4. The electronic component package of claim 1 further comprising a base assembly mounting adhesive coupling an inner surface of a second substrate to a principal surface of the molded ring.

5. The electronic component package of claim 4 wherein the molded cavity is sealed by the inner surface of the second substrate and the base assembly mounting adhesive.

6. The electronic component package of claim 1 wherein the molded ring comprises:

a substrate surface directly adherent to an outer peripheral region of an inner surface of the first substrate with a central region of the inner surface of the first substrate exposed by the molded ring.

7. The electronic component package of claim 6 wherein the molded ring further comprises:

a principal surface;

outer sidewalls extending between the substrate surface and the principal surface; and

inner sidewalls extending between the substrate surface and the principal surface.

8. The electronic component package of claim 1 wherein:

the through vias comprise a MEMS via,

the electronic component package further comprising a second substrate comprising an inner trace coupled to an inner surface of the second substrate, and

a bond pad of the MEMS electronic component is coupled to a bond finger of the inner trace, the MEMS via coupled to a MEMS terminal of the inner trace.

9. The electronic component package of claim 1 wherein the electrically conductive through vias comprise a ground via, and the electronic component package further comprising a second substrate comprising:

a ground terminal coupled to an inner surface of the second substrate; and

a ground plane coupled to an outer surface of the second substrate and coupled to the ground terminal, the ground via coupled to the ground terminal.

10. The electronic component package of claim 1 further comprising a molded cavity substrate port extending through the first substrate.

11. The electronic component package of claim 1 further comprising:

a second substrate coupled to the molded ring, the second substrate comprising an inner trace coupled to an inner surface of the second substrate; and

an electrically conductive MEMS solder column coupled to one of the inner terminals and a MEMS terminal of the inner trace, the MEMS solder column extending through the molded ring.

12. The electronic component package of claim 1 further comprising:

a second substrate coupled to the molded ring, the second substrate comprising a ground terminal coupled to an inner surface of the second substrate; and

an electrically conductive ground solder column coupled to one of the inner terminals and the ground terminal, the ground solder column extending through the molded ring.

13. An electronic component package comprising:

a molded cavity substrate comprising;

a first substrate; and

a molded ring coupled to the first substrate, the molded ring comprising a molded cavity;

and

a base assembly comprising;

a second substrate comprising an inner surface coupled to the molded ring, the second substrate further comprising outer traces coupled to an outer surface of the second substrate; and

a Micro Electro Mechanical Systems (MEMS) electronic component coupled to the inner surface of the second substrate and located within the molded cavity;

wherein;

the molded ring is coupled to an inner surface of the first substrate; and

the first substrate further comprises a ground plane coupled to an outer surface of the first substrate.

14. The electronic component package of claim 13 wherein:

the molded cavity substrate further comprises a ground via extending through the molded ring, the ground via coupling the ground plane to the outer traces on the outer surface of the second substrate.

16. The electronic component package of claim 13 further comprising a converter electronic component coupled to the inner surface of the second substrate and located within the molded cavity.

15. The electronic component package of 13 wherein:

the molded cavity substrate further comprises a ground solder column extending through the molded ring, the ground solder column coupling the ground plane to the outer traces on the outer surface of the second substrate.

17. A method of manufacturing an electronic component package, the method comprising:

molding a dielectric material on a first substrate to form a molded ring,

the molded ring comprising a molded cavity,

the first substrate comprising inner terminals;

providing a Micro Electro Mechanical Systems (MEMS) electronic component within the molded cavity; and

at least one of;

(a) providing electrically conductive through vias coupled to the inner terminals and extending through the molded ring;

or

(b) providing a second substrate and a solder column,

the second substrate coupled to the molded ring and comprising at least one of;

an inner trace coupled to an inner surface of the second substrate, or

a ground terminal coupled to the inner surface of the second substrate,

the solder column extending through the molded ring and comprising at least one of;

an electrically conductive MEMS solder column coupled to one of the inner terminals and to a MEMS terminal of the inner trace, or

an electrically conductive ground solder column coupled to one of the inner terminals and to the ground terminal.

18. The method of claim 17 further comprising:

forming pre-attached solder balls coupled to inner terminals coupled to an inner surface of the first substrate, wherein the molding a dielectric material on a first substrate to form a molded ring comprises completely enclosing the pre-attached solder balls in the molded ring; and

exposing the pre-attached solder balls from the molded ring.

19. The method of claim 17, further comprising:

coupling the MEMS electronic component to the inner surface of the second substrate.

20. An electronic component package comprising:

a Micro Electro Mechanical Systems (MEMS) electronic component;

a first substrate; and

a molded ring coupled to the first substrate, the molded ring comprising a molded cavity, the MEMS electronic component being located within the molded cavity, wherein;

the first substrate comprises an inner terminal; and

the electronic component package further comprises;

a second substrate coupled to the molded ring, the second substrate comprising an inner trace coupled to an inner surface of the second substrate; and

an electrically conductive MEMS solder column coupled to the inner terminal and a MEMS terminal of the inner trace, the MEMS solder column extending through the molded ring.

21. An electronic component package comprising:

a Micro Electro Mechanical Systems (MEMS) electronic component;

a first substrate; and

a molded ring coupled to the first substrate, the molded ring comprising a molded cavity, the MEMS electronic component being located within the molded cavity, wherein;

the first substrate comprises an inner terminal, the electronic component package further comprises;

a second substrate coupled to the molded ring, the second substrate comprising a ground terminal coupled to an inner surface of the second substrate; and

an electrically conductive ground solder column coupled to the inner terminal and the ground terminal, the ground solder column extending through the molded ring.