Wireless electric power supply type light-emitting element and light-emitting device

• US 9,030,098 B2
• Filed: 08/03/2012
• Issued: 05/12/2015
• Est. Priority Date: 01/05/2012
• Status: Expired due to Fees

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Nakai, Takahiro, Morita, Shigenori, Hatanaka, Takezo, Tsuda, Hisashi
• Primary Examiner(s): VO, TUYET THI
• Application Number:
  US14/116,892
• Publication Number:
  US 20140327356A1
• Time in Patent Office: 1,012 Days
• Field of Search: 313483-512, 345 76- 92, 345/102, 345211-214, 345/204, 257 79-103
• US Class Current: 313/512
• CPC Class Codes: G06K 7/00 Methods or arrangements for sensing record carriers, e.g. for reading patterns methods or arrangements for marking the record carrier in digital fashion G06K1/00; pattern recognition G06F18/00; arrangements for image or video recognition or understanding G06V10/00; character recognition, recognising digital ink or document-oriented image-based pattern recognition G06V30/00
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H05B 45/60 Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A wireless electric power supply type light-emitting element 11 of the present invention includes a substrate 2; a light-emitting structure provided on the substrate 2; and a sealing layer 3 provided on the light-emitting structure, wherein the light-emitting structure includes an electric power receiving antenna 4 and an organic electroluminescence element provided on the installation surface of the substrate 2; and two connecting wires 61 and 62 for electrically connecting the electric power receiving antenna 4 and the organic electroluminescence element, the electric power receiving antenna 4 is covered with an insulating layer 7 exclusive of two terminals 41 and 42 of the electric power receiving antenna 4 to which the end parts of the two connecting wires 61 and 62 are connected, and the light-emitting structure is sealed between the substrate 2 and the sealing layer 3.

Claims

1. A wireless electric power supply type light-emitting element comprising a substrate;

a light-emitting structure provided on the substrate; and

a sealing layer provided on the light-emitting structure,

wherein the light-emitting structure comprises an electric power receiving antenna and an organic electroluminescence element which are provided on the installation surface of the substrate; and

two connecting wires for electrically connecting the electric power receiving antenna and the organic electroluminescence element,

the organic electroluminescence element comprises a first electrode;

a second electrode; and

an organic layer provided between the first electrode and the second electrode and including a light-emitting layer,

the electric power receiving antenna is covered with an insulating layer exclusive of two terminals of the electric power receiving antenna to which the end parts of the two connecting wires are connected, and

the light-emitting structure is sealed between the substrate and the sealing layer.

2. The wireless electric power supply type light-emitting element according to claim 1,

wherein at least one of the two connecting wires is provided so as to extend over the upper surface of the insulating layer to the installation surface of the substrate,

and the upper surface of the insulating layer on which the connecting wire is provided is an inclined surface inclined with respect to the installation surface, and the internal angle formed by the inclined surface and the installation surface is 5 degrees to 60 degrees.

3. The wireless electric power supply type light-emitting element according to claim 1, wherein a magnetic layer is provided between the substrate and the electric power receiving antenna.

4. The wireless electric power supply type light-emitting element according to claim 1, wherein the substrate includes a metal plate, and a ground insulating layer is provided between the substrate and the organic electroluminescence element.

5. The wireless electric power supply type light-emitting element according to claim 1, wherein the connecting wire is formed of a vapor-deposited film.

6. A light-emitting device comprising the wireless electric power supply type light-emitting element according to claim 1;

and an electric power transmitter.

7. The wireless electric power supply type light-emitting element according to claim 1, wherein the sealing layer comprises a sealing plate which is situated above the light-emitting structure and so arranged as to face the substrate;

and a sealing resin which is situated between the substrate and the sealing plate and provided at least at the periphery of the light-emitting structure.

8. The wireless electric power supply type light-emitting element according to claim 7, wherein the thickness of the sealing resin exposed to the outside is no more than 1.2 times the thickness of the electric power receiving antenna.

9. The wireless electric power supply type light-emitting element according to claim 7, wherein the sealing resin is bonded directly to the upper surface of the substrate at the outside of the periphery of the light-emitting structure.

10. The wireless electric power supply type light-emitting element according to claim 7,

wherein the sealing plate comprises a plate-shaped body facing the substrate;

and a ring-shaped raised portion projected downward from the peripheral edge part of the plate-shaped body, and

the sealing resin is provided between the substrate and the ring-shaped raised portion.

11. The wireless electric power supply type light-emitting element according to claim 7, wherein the sealing resin is provided between the substrate and the sealing plate without a gap.