Thin substrate electrostatic chuck system and method
First Claim
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1. A processing system, comprising:
- an electrostatic chuck for holding a workpiece, the workpiece comprising a semiconductor substrate attached to an electrically insulating carrier, wherein, when the electrostatic chuck holds the workpiece, the electrically insulating carrier of the workpiece is disposed between the electrostatic chuck and the semiconductor substrate of the workpiece;
an AC power supply electrically coupled to the electrostatic chuck;
wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by a voltage supplied to the electrostatic chuck;
wherein the supplied voltage is dependent on at least one property of the electrically insulating carrier.
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Abstract
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate attached to an electrically insulating carrier; and an AC power supply electrically coupled to the electrostatic chuck.
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Citations
34 Claims
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1. A processing system, comprising:
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an electrostatic chuck for holding a workpiece, the workpiece comprising a semiconductor substrate attached to an electrically insulating carrier, wherein, when the electrostatic chuck holds the workpiece, the electrically insulating carrier of the workpiece is disposed between the electrostatic chuck and the semiconductor substrate of the workpiece; an AC power supply electrically coupled to the electrostatic chuck; wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by a voltage supplied to the electrostatic chuck; wherein the supplied voltage is dependent on at least one property of the electrically insulating carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A processing system, comprising:
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an electrostatic chuck for holding a workpiece, the workpiece comprising a semiconductor substrate attached to an electrically insulating carrier, wherein, when the electrostatic chuck holds the workpiece, the electrically insulating carrier of the workpiece is disposed between the electrostatic chuck and the semiconductor substrate of the workpiece; an AC power supply electrically coupled to the electrostatic chuck wherein the AC power supply provides a voltage of at least 500 V peak to peak; wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by the provided voltage. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of manufacturing a device, the method comprising:
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providing a semiconductor substrate; attaching the semiconductor substrate to an electrically insulating carrier, thereby forming a workpiece; supporting the workpiece, which comprises the semiconductor substrate and the electrically insulating carrier, with an electrostatic chuck, the electrically insulating carrier of the workpiece being disposed between the electrostatic chuck and the semiconductor substrate of the workpiece; wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by a voltage supplied to the electrostatic chuck; wherein a voltage supplied to the electrostatic chuck is related to at least one property of the electrically insulating carrier of the workpiece. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification