Microelectromechanical load sensor and methods of manufacturing the same

• US 9,032,818 B2
• Filed: 07/03/2013
• Issued: 05/19/2015
• Est. Priority Date: 07/05/2012
• Status: Active Grant

• Current Assignee: NextInput Inc. (Qorvo, Inc.)
• Original Assignee: NextInput Inc. (Qorvo, Inc.)
• Inventors: Diestelhorst, Ryan, Campbell, Ian
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): DAVIS HOLLINGTON, OCTAVIA L
• Application Number:
  US13/934,900
• Publication Number:
  US 20140007705A1
• Time in Patent Office: 685 Days
• Field of Search: 738/626.28
• US Class Current: 73/862.628
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81C 1/00134 comprising flexible or deformable structures manufacture of MEMS devices for specific applications, see relevant places, e.g. gyroscopes G01C19/5719, pressure sensors G01L9/0042, accelerometers G01P15/0802, acoustic transducers or diaphragms therefor H04R31/00
• CPC Class Codes: G01L 1/148 using semiconductive material, e.g. silicon
• CPC Class Codes: G01L 1/18 using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• CPC Class Codes: G01L 1/26 Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
• CPC Class Codes: G01L 5/162 of piezoresistors

Abstract

A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.

Claims

1. A microelectromechanical (MEMS) load sensor device, comprising:

a substrate defining a deformable membrane, a mesa and an overload protection portion, the mesa being configured to receive and transfer an applied force to the deformable membrane, the deformable membrane being configured to deform in response to the applied force; and

at least one load sensor element formed on the deformable membrane, the load sensor element being configured to change at least one electrical characteristic based on an amount or magnitude of the applied force, wherein a height of the mesa is greater than a height of the overload protection portion.

2. The MEMS load sensor device of claim 1, wherein the mesa defines a contact surface for receiving the applied force.

4. The MEMS load sensor device of any of claim 1, wherein the mesa is arranged in a central portion of the substrate.

5. The MEMS load sensor device of claim 1, wherein the overload protection portion is arranged in a peripheral portion of the substrate.

6. The MEMS load sensor device of claim 1, further comprising a touch surface fixed to at least a portion of the mesa, wherein the touch surface is configured to receive and transfer the applied force to the mesa.

7. The MEMS load sensor device of claim 6, wherein a gap is arranged between the touch surface and the overload protection portion when the touch surface is fixed to the mesa, the gap limiting an amount of deflection of the deformable membrane and preventing the deformable membrane from mechanically failing under an excessive applied force.

8. The MEMS load sensor device of claim 1, further comprising one or more electromechanical connectors for connecting the MEMS load sensor device to an external circuit.

9. The MEMS load sensor device of claim 1, wherein the deformable membrane, the mesa and the overload protection portion are formed by removing a portion of the substrate.

10. The MEMS load sensor device of claim 9, wherein the substrate has a first surface and a second surface opposite to the first surface, and the deformable membrane, the mesa and the overload protection portion are formed using a deep reactive ion etching technique on the second surface.

11. The MEMS load sensor device of claim 10, wherein one or more electromechanical connectors for connecting the MEMS load sensor device to an external circuit are formed on the first surface.

12. The MEMS load sensor device of claim 1, wherein the load sensor element comprises a piezoresistive element.

13. The MEMS load sensor device of claim 12, further comprising a plurality of piezoresistive elements electrically connected in a Wheatstone bridge circuit.

14. The MEMS load sensor device of claim 13, further comprising an activation circuit for supplying a voltage to the Wheatstone bridge circuit and for communicating a differential output voltage from the Wheatstone bridge circuit.

15. The MEMS load sensor device of claim 14, wherein the activation circuit comprises:

one or more output signal traces for communicating the differential output voltage from the Wheatstone bridge circuit to a signal bus;

one or more voltage supply traces for connecting the Wheatstone bridge circuit to an external voltage source;

a row trace and a column trace for addressing the MEMS load sensor device;

a logical gate having an input and output, the input of the logical gate being connected to the row and column traces; and

one or more switches connected to the output of the logical gate, wherein each switch is configured to electrically connect an output trace and the signal bus or a voltage supply trace and the external voltage source.

3. The MEMS load sensor device of 2, wherein the contact surface has at least one of a substantially square, rectangular, rounded, circular or elliptical shape.

16. A method for manufacturing a microelectromechanical (MEMS) load sensor device, comprising:

providing a substrate having a first surface and a second surface opposite to the first surface;

forming at least one load sensor element on the first surface of the substrate; and

etching the second surface of the substrate to form a deformable membrane, a mesa and an overload protection portion, the mesa being configured to receive and transfer an applied force to the deformable membrane, the deformable membrane being configured to deform in response to the applied force, and the load sensor element being provided on the deformable membrane and being configured to change at least one electrical characteristic based on an amount or magnitude of the applied force, wherein a height of the mesa is greater than a height of the overload protection portion.

17. The method of claim 16, wherein etching the second surface of the substrate to form a deformable membrane, a mesa and an overload protection portion further comprises:

applying a layer of photoresist over the second surface of the substrate;

irradiating a portion of the layer of photoresist with ultraviolet light through a mask;

removing the irradiated portion of the layer of photoresist to expose a portion of the second surface of the substrate; and

etching the exposed portion of the second surface of the substrate to form the deformable membrane, the mesa and the overload protection portion.

18. The method of claim 16, wherein forming at least one load sensor element on the first surface of the substrate further comprises:

applying a layer of silicon oxide over the first surface of the substrate;

applying a layer of photoresist over the layer of silicon oxide;

irradiating a portion of the layer of photoresist with ultraviolet light through a mask;

removing the irradiated portion of the layer of photoresist to expose a portion of the layer of silicon oxide;

etching the exposed portion of the layer of silicon oxide to expose a portion of the first layer of the substrate; and

forming the load sensor element on the exposed portion of the first layer of the substrate.

19. The method of claim 18, wherein the load sensor element is a piezoresistive element formed using an ion implantation technique.

20. The method of claim 16, further comprising fixing a touch surface to at least a portion of the mesa, wherein the touch surface is configured to receive and transfer the applied force to the mesa, wherein a gap is arranged between the touch surface and the overload protection portion when the touch surface is fixed to the mesa, the gap limiting an amount of deflection of the deformable membrane and preventing the deformable membrane from mechanically failing under an excessive applied force.