Method for producing light-transmitting electromagnetic wave-shielding film, light-transmitting electromagnetic wave-shielding film and plasma display panel using the shielding film

• US 9,034,419 B2
• Filed: 12/22/2008
• Issued: 05/19/2015
• Est. Priority Date: 12/27/2002
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Sasaki, Hirotomo, Nishizakura, Ryou, Morimoto, Kiyoshi, Takada, Shunji
• Primary Examiner(s): VETERE, ROBERT A
• Application Number:
  US12/341,811
• Publication Number:
  US 20090110912A1
• Time in Patent Office: 2,339 Days
• Field of Search: 427/99.5, 427/331, 427/553
• US Class Current: 427/108
• CPC Class Codes: C03C 17/10 by deposition from the liquid phase
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3676 specially adapted for use as electromagnetic shield
• CPC Class Codes: C03C 2217/256 Ag
• CPC Class Codes: C03C 2217/445 Organic continuous phases
• CPC Class Codes: C03C 2217/475 Inorganic materials
• CPC Class Codes: C03C 2217/93 Coatings containing a reinforcement comprising fibers or grids
• CPC Class Codes: C03C 2218/11 from solutions or suspensions
• CPC Class Codes: G02F 1/133334 Electromagnetic shields
• CPC Class Codes: G03C 1/08 Sensitivity-increasing substances
• CPC Class Codes: G03C 5/58 Processes for obtaining metallic images by vapour deposition or physical development images obtained by photomechanical means, e.g. by etching G03F
• CPC Class Codes: H01J 11/44 Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
• CPC Class Codes: H01J 2211/446 Electromagnetic shielding means; Antistatic means
• CPC Class Codes: H01J 2229/8636 Electromagnetic shielding
• CPC Class Codes: H01J 2329/869 Electromagnetic shielding
• CPC Class Codes: H01J 29/868 Screens covering the input or output face of the vessel, e.g. transparent anti-static coatings, X-ray absorbing layers
• CPC Class Codes: H01J 9/205 Applying optical coatings or shielding coatings to the vessel of flat panel displays, e.g. applying filter layers, electromagnetic interference shielding layers, anti-reflection coatings or anti-glare coatings
• CPC Class Codes: H05K 3/106 by photographic methods
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/26 : Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 442/10 : Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
• CPC Class Codes: Y10T 442/109 : Metal or metal-coated fiber-containing scrim
• CPC Class Codes: Y10T 442/112 : Particulate free metal or alloy constituent
• CPC Class Codes: Y10T 442/164 : Including a preformed film, foil, or sheet

Abstract

A silver salt-containing layer containing a silver salt and provided on a support is exposed and developed to form a metal silver portion and a light-transmitting portion, and then the metal silver portion is further subjected to physical development and/or plating to form a conductive metal portion consisting of the metal silver portion carrying conductive metal particles. A method for producing a light-transmitting electromagnetic wave-shielding film which enables production of an electromagnetic wave-shielding material simultaneously having high EMI-shielding property and high transparency in a fine line pattern and also enables mass production of such films at a low cost, and a light-transmitting electromagnetic wave-shielding film obtained by the production method and free from the problem of moire are provided.

Claims

1. A method for producing a metal silver pattern, comprising exposing and developing a silver halide-containing layer, which contains a silver halide and is provided on a support, to form the metal silver pattern,

wherein the silver halide-containing layer contains Ag and a binder and has an Ag/binder volume ratio of 1/1 or higher, and

the silver halide-containing layer is developed with a development technique used for a silver halide photographic film.

2. The method according to claim 1, wherein the silver halide consists mainly of silver bromide.

3. The method according to claim 1, wherein the silver halide contains a rhodium compound and/or an iridium compound.

4. The method according to claim 1, wherein the silver halide contains Pd(II) ions and/or Pd metal.

5. The method according to claim 1, wherein the silver halide-containing layer has an Ag/binder volume ratio of 1/1 to 2.

6. The method according to claim 1, wherein the silver halide in the silver halide-containing layer has a diameter as sphere of 0.1 to 100 nm, wherein diameter as sphere means the diameter of a particle of silver halide having a spherical shape and the same volume.

7. The method according to claim 1, wherein the developer used for the development of the silver halide-containing layer is a lith developer.

8. The method according to claim 1, wherein an exposed portion after the development contains metal silver at a content of 50% by weight or more based on the weight of silver contained in the exposed portion before the exposure.

9. The method according to claim 1, further comprising subjecting the metal silver pattern to electroless plating to form a conductive metal pattern comprising the metal silver portion carrying conductive metal particles.

10. The method according to claim 9, wherein the surface of the conductive metal pattern is subjected to a blackening treatment.

11. The method according to claim 1, further comprising subjecting the metal silver pattern to physical development and/or electroless plating to form a conductive metal pattern comprising the metal silver portion carrying conductive metal particles, and

wherein the conductive metal pattern has a surface resistance of 2.5 Ω

/sq or lower.

12. The method according to claim 1, wherein the support is a plastic film, a plastic plate or a glass plate.

13. The method according to claim 1, additionally comprising removing silver halide from unexposed regions of the silver halide-containing layer.

14. The method according to claim 1, wherein the silver halide functions as an optical sensor.

15. The method according to claim 1, wherein the binder includes water-soluble polymers.

16. The method according to claim 1, wherein the binder includes gelatin.

17. The method according to claim 1, additionally comprising fixing the developed and exposed silver halide-containing layer.

18. The method according to claim 1, wherein the metal silver pattern has an aperture ratio of 85% or higher.