Touch screen substrate and method of manufacturing a touch screen substrate

• US 9,034,420 B2
• Filed: 09/25/2013
• Issued: 05/19/2015
• Est. Priority Date: 12/07/2009
• Status: Expired due to Fees

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Sung, Woo-Yong, Cha, Tae-Woon, Kim, Tae-Gyun
• Primary Examiner(s): LIGHTFOOT, ELENA TSOY
• Application Number:
  US14/036,269
• Publication Number:
  US 20140023778A1
• Time in Patent Office: 601 Days
• Field of Search: 427/58, 427/110
• US Class Current: 427/110
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A method of manufacturing a touch screen substrate includes forming a sensing electrode on a substrate, spraying a first ink and a second ink on the substrate including the sensing electrode, where the first ink includes a first solvent and insulation balls having a first diameter and the second ink includes a second solvent and conductive balls having a second diameter smaller than the first diameter, and hardening the first and second inks on the substrate, to fix the insulation balls on the substrate and the conductive balls on the sensing electrode formed on the substrate.

Claims

1. A method of manufacturing a touch screen substrate, the method comprising:

forming a sensing electrode and a sensor line on a substrate;

spraying a first ink on the sensor line formed on the substrate and a second ink on the sensing electrode formed on the substrate, the first ink including a first solvent and insulation balls having a first diameter, the second ink including a second solvent and conductive balls having a second diameter smaller than the first diameter; and

hardening the first and second inks on the substrate, to fix the insulation balls on the sensor line formed on the substrate and the conductive balls on the sensing electrode formed on the substrate.

2. The method of claim 1, wherein the first and second inks are sprayed from an assembly including a first print head filled with the first ink and a second print head filled with the second ink, and wherein the assembly moves over the substrate to spray the first and second inks.

3. The method of claim 1, wherein hardening the first and second inks sprayed on the substrate comprises:

partially evaporating the first solvent and hardening the first ink to form a first hardener around a first contact point between the insulation ball and the sensor line; and

partially evaporating the second solvent and hardening the second ink to form a second hardener around a second contact point between the conductive ball and the sensing electrode.

4. The method of claim 1, wherein the sensing electrode and the sensor line are formed in a light blocking region surrounding a light transmission region of the substrate;

and wherein the method further comprises forming a pixel electrode separated from the sensing electrode in the light transmission region of the substrate.

5. The method of claim 1, wherein the sensing electrode is formed in a light blocking region surrounding a light transmission of the substrate;

and wherein the method further comprises forming a common electrode on a substrate spaced apart from the substrate having the sensing electrode;

the common electrode being connected to the sensing electrode in the light transmission region.