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Method of testing of MEMS devices on a wafer level

  • US 9,034,666 B2
  • Filed: 11/07/2011
  • Issued: 05/19/2015
  • Est. Priority Date: 12/29/2003
  • Status: Expired due to Fees
First Claim
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1. A method of automated volume electromechanical testing of MEMS devices on a wafer level comprising steps of:

  • providing a wafer with MEMS devices for testing;

    providing a test system comprising probes for electrical contacts to at least one testing MEMS device and a force actuator configured to apply force to at least some areas and at least in some directions to the at least one testing MEMS device;

    providing a test specification and a test program;

    selecting at least the testing MEMS device according to the test program and applying one or more electrical probes to the testing MEMS device;

    providing power to at least the testing MEMS device through the one or more electrical probes;

    measuring a first set of output signals of the testing MEMS device;

    applying force to the testing MEMS device under at least two different test conditions using the force actuator to apply forces, the at least two different test conditions are chosen from the group of;

    one or more forces applied in at least two different locations, and one or more forces applied in at least two non-collinear directions;

    measuring a second set of output signals of the testing MEMS device while the force under at least two different test conditions is applied;

    determining whether MEMS devices have been tested according to the test program, and choosing the next step, based on whether the MEMS devices have been tested according to the test program, from the group of steps comprising of;

    returning back to the group of steps starting with selecting at least one next MEMS device for testing; and

    moving further to the step of processing test data;

    processing the test data and generating output test results according to the test specification and test program;

    whereby at least the second set of output signals corresponding to at least the two different test conditions of applied force are linearly independent, which, after processing, results in characterization of multi-axis MEMS device as at least two-axis MEMS device.

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