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Method of forming a micro device transfer head with silicon electrode

  • US 9,034,754 B2
  • Filed: 05/25/2012
  • Issued: 05/19/2015
  • Est. Priority Date: 05/25/2012
  • Status: Active Grant
First Claim
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1. A method of forming a micro device transfer head array comprising:

  • etching a top silicon layer of a silicon-on-insulator stack to form a silicon interconnect and a plurality of silicon electrodes electrically connected with the silicon interconnect, each silicon electrode including a mesa structure that protrudes above the silicon interconnect; and

    forming a dielectric layer over the plurality of silicon electrodes.

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