Forming semiconductor chip connections

• US 9,035,465 B2
• Filed: 05/09/2014
• Issued: 05/19/2015
• Est. Priority Date: 05/26/2009
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Cheng, Kangguo, Dalton, Timothy J., Farooq, Mukta G., Fitzsimmons, John A., Hsu, Louis L.
• Primary Examiner(s): Payen, Marvin
• Assistant Examiner(s): JOY, JEREMY J
• Application Number:
  US14/273,975
• Publication Number:
  US 20140332929A1
• Time in Patent Office: 375 Days
• Field of Search: 257/686, 257/779, 257/E21.511, 438/109, 438/113
• US Class Current: 257/777
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06183 On contiguous sides of the body
• CPC Class Codes: H01L 2224/13009 Bump connector integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/14183 On contiguous sides of the body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16105 the bump connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/16137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/16147 the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/81205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06524 : Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06551 : Conductive connections on the side of the device
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 27/0207 : Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Various embodiments include semiconductor structures. In one embodiment, the semiconductor structure includes a chip having a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.

Claims

1. A semiconductor structure comprising:

a plurality of semiconductor chips, each of the plurality of semiconductor chips including;

a body having a polyhedron shape with a pair of opposing sides;

a first solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the plurality of semiconductor chips being connected to each other by the solder ball element of each of the semiconductor chips; and

a first connector chip including;

a body having a polyhedron shape with a pair of opposing substantially planar sides;

a solder member extending a side that extends between the opposing substantially planar sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the first connector chip being connected to each of the plurality of semiconductor chips,

wherein the first connector chip forms a substantially right angle with each of the plurality of semiconductor chips.

2. The semiconductor structure of claim 1, further comprising:

a second connector chip, the second connector chip including;

a body having a polyhedron shape with a pair of opposing sides;

a solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the second connector chip being connected to each of the plurality of semiconductor chips.

3. The semiconductor structure of claim 1, further comprising a substrate, wherein the connector chip is connected to the substrate by the solder member of the connector chip that extends completely along the side that extends between the opposing substantially planar sides of the polyhedron shape, wherein the each of the plurality of semiconductor chips is connected to the substrate by the solder ball element of the each of the plurality of semiconductor chips.

4. The semiconductor structure of claim 3, wherein the solder member in each of the plurality of semiconductor chips further extends over a corner formed by adjacent sides of the body of each of the plurality of semiconductor chips.

5. A semiconductor structure comprising:

a plurality of semiconductor chips, each of the plurality of semiconductor chips including;

a body having a polyhedron shape with a pair of opposing sides;

a first solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the plurality of semiconductor chips being connected to each other by the solder ball element of each of the semiconductor chips;

a first connector chip including;

a body having a polyhedron shape with a pair of opposing substantially planar sides;

a solder member extending completely along a side that extends between the opposing substantially planar sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the first connector chip being connected to each of the plurality of semiconductor chips,

wherein the first connector chip forms a substantially right angle with each of the plurality of semiconductor chips;

a second connector chip, the second connector chip including;

a body having a polyhedron shape with a pair of opposing sides;

a solder member extending completely along a side that extends between the opposing sides of the polyhedron shape; and

a solder ball element located on a surface of one of the pair of opposing sides,

the second connector chip being connected to each of the plurality of semiconductor chips; and

a substrate, wherein the connector chip is connected to the substrate by the solder member of the connector chip that extends completely along the side that extends between the opposing substantially planar sides of the polyhedron shape, wherein the each of the plurality of semiconductor chips is connected to the substrate by the solder ball element of the each of the plurality of semiconductor chips,

wherein the solder member in each of the plurality of semiconductor chips further extends over a corner formed by adjacent sides of the body of each of the plurality of semiconductor chips.