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Circuit device and method of manufacturing the same

  • US 9,035,473 B2
  • Filed: 09/28/2009
  • Issued: 05/19/2015
  • Est. Priority Date: 09/30/2008
  • Status: Active Grant
First Claim
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1. A circuit device comprising:

  • a semiconductor element;

    a conductive member which is connected to the semiconductor element via a thin metal wire; and

    a sealing resin which comprises a resin material mixed with filler particles and which covers the semiconductor element and the thin metal wire, wherein the sealing resin includes a first portion and a second portion, the first portion of the sealing resin below a top portion of the thin metal wire, the second portion of the sealing resin between the top portion of the thin metal wire and a top surface of the sealing resin, and wherein the second portion has a first layer that includes filler particles and a second layer having no filler particles, a thickness of the second layer less than a thickness of the first layer, andwherein a thickness of the second portion of the sealing resin is smaller than a maximum diameter of the filler particles and wherein the second portion is continuous with the first portion.

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