Charger assembly with heat transfer duct

• US 9,035,597 B2
• Filed: 11/30/2011
• Issued: 05/19/2015
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Lear Corporation
• Original Assignee: Lear Corporation
• Inventors: Sharaf, Nadir, Pavlovic, Slobodan, Rai, Rutunj, Daftuar, Dilip, Lopez, Juan, Rathod, Reshma
• Primary Examiner(s): Berhanu, Samuel
• Application Number:
  US13/307,222
• Publication Number:
  US 20130134925A1
• Time in Patent Office: 1,266 Days
• Field of Search: 320/107
• US Class Current: 320/107
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A charger assembly is provided with a housing having a cavity with an opening. A cover is fastened to the housing for covering the opening. A heat transfer duct is mounted to the cover with an inlet end and an outlet end each extending through the cover. A plurality of heat sinks is mounted to the cover in contact with the heat transfer duct. A plurality of circuit board assemblies are each mounted to the cover in contact with the plurality of heat sinks.

Claims

1. A charger assembly comprising:

a housing having a cavity with an opening;

a cover fastened to the housing to cover the opening;

a heat transfer duct mounted to the cover with an inlet end and an outlet end each extending through the cover;

a plurality of heat sinks mounted to the cover in contact with the heat transfer duct; and

a plurality of circuit board assemblies each mounted to the cover in contact with the plurality of heat sinks;

wherein the heat transfer duct comprises a bent piece of round tubing having an inlet region extending through the cover from the inlet end in a depth direction of the housing, an intermediate region extending transversely through the housing, and an outlet region extending in the depth direction through the cover from the intermediate region to the outlet end; and

wherein each heat sink comprises a generally planar contact portion to contact the circuit board assembly, and a curved portion to extend around the round tubing.

2. The charger assembly of claim 1 further comprising a substrate supported upon the cover and extending into the cavity, wherein the heat transfer duct, the plurality of heat sinks, and the plurality of circuit board assemblies are mounted to the substrate.

3. The charger assembly of claim 2 wherein the substrate has an aperture pattern;

wherein each circuit board assembly has an aperture pattern; and

wherein the charger assembly further comprises a plurality of fasteners, each fastener extending through the aperture pattern of one of the circuit board assemblies and the substrate to affix the circuit board assemblies to the substrate.

4. The charger assembly of claim 3 wherein the substrate has a plurality of recesses formed therein each sized to receive one of the heat sinks.

5. The charger assembly of claim 4 wherein the plurality of heat sinks is retained in the plurality of recesses by the circuit board assemblies.

15. The charger assembly of claim 1 wherein the tubing has a uniform wall thickness.

6. A charger assembly comprising:

a housing having a cavity with an opening adjacent to a mounting surface;

a cover fastened to the mounting surface to cover the opening;

a substrate supported upon the cover and extending into the cavity;

a heat transfer duct mounted to the substrate with an inlet end and an outlet end each extending through the cover;

a plurality of circuit board assemblies each mounted to the substrate in conductive connection with the heat transfer duct;

wherein the cover is fastened to the mounting surface without an additional seal;

a plurality of heat sinks mounted to the cover in contact with the heat transfer duct and in contact with the plurality of circuit board assemblies;

wherein the heat transfer duct comprises a bent piece of round tubing having an inlet region extending through the cover from the inlet end in a depth direction of the housing, an intermediate region extending transversely through the housing, and an outlet region extending in the depth direction through the cover from the intermediate region to the outlet end; and

wherein each heat sink comprises a generally planar contact portion to contact the circuit board assembly, and a curved portion to extend around the round tubing.

7. The charger assembly of claim 6 further comprising a plurality of connectors mounted to the cover in electrical connection with the plurality of circuit board assemblies.

8. The charger assembly of claim 7 wherein the plurality of connectors comprises two power connectors and one signal connector.

9. The charger assembly of claim 6 wherein the housing has only one opening.

10. The charger assembly of claim 6 wherein the housing has a channel formed therein to receive a proximal end of the substrate.

11. The charger assembly of claim 6 wherein the housing is formed from a conductive plastic material.

12. A method for assembling a charger assembly comprising:

—

Installing a heat transfer duct to a cover with an inlet end and an outlet end each extending through the cover, wherein the heat transfer duct comprises a bent piece of round tubing having an inlet region extending through the cover from the inlet end in a depth direction of a housing, an intermediate region extending transversely through the housing, and an outlet region extending in the depth direction through the cover from the intermediate region to the outlet end;

Installing a plurality of circuit board assemblies to the cover in conductive connection with the heat transfer duct;

Installing the cover to the housing such that the circuit board assemblies are oriented within a cavity in the housing and enclosed by the cover;

Installing the heat transfer duct to a substrate prior to installing the heat transfer duct to the cover;

assembling a plurality of heat sinks to the substrate each in contact with the heat transfer duct prior to installing the cover to the housing, wherein each heat sink comprises a generally planar contact portion to contact the plurality of circuit board assemblies, and a curved portion to extend around the round tubing; and

assembling the plurality of heat sinks to the substrate without fastening the heat sinks to the substrate.

13. The method of claim 12 further comprising inserting the inlet and outlet ends of the heat transfer duct through the cover prior to installing the cover to the housing;

and

installing the cover upon the substrate prior to installing the cover to the housing.

14. The method of claim 13 further comprising installing the plurality of circuit board assemblies to the substrate, each in contact with one of the plurality of heat sinks prior to installing the cover to the housing.