Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors
First Claim
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1. A plurality of thickness shear mode resonator sensors produced by a process, comprising:
- forming a plurality of active wafer locations in a first sheet of material comprising;
locating a central portion of each active wafer of the plurality of active wafer locations; and
bounding the plurality of active wafer locations about the central portions thereof to form a first cavity on a first side of each central portion and a second cavity on a second side of each central portion to form an array of resonator sensors; and
separating the array of resonator sensors.
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Abstract
Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
64 Citations
14 Claims
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1. A plurality of thickness shear mode resonator sensors produced by a process, comprising:
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forming a plurality of active wafer locations in a first sheet of material comprising; locating a central portion of each active wafer of the plurality of active wafer locations; and bounding the plurality of active wafer locations about the central portions thereof to form a first cavity on a first side of each central portion and a second cavity on a second side of each central portion to form an array of resonator sensors; and separating the array of resonator sensors. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of forming a plurality of resonator sensors, comprising:
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forming a plurality of active wafer locations in a unitary structure; coupling a plurality of first end cap structures to a first side of the unitary structure; coupling a plurality of second end cap structures to a second, opposing side of the unitary structure; and separating the plurality of active wafer locations laterally between the end cap structures to form a plurality of discrete resonator sensors.
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8. A method of forming a plurality of resonator sensors, comprising:
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forming a plurality of active wafer locations in a first sheet of material comprising; locating a central portion of each active wafer of the plurality of active wafer locations; bounding the plurality of active wafer locations about the central portions thereof to form a first cavity on a first side of each central portion and a second cavity on a second side of each central portion to form an array of resonator sensors; and separating the array of resonator sensors to form a plurality of discrete resonator sensors. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification