Sensor package and method of forming same
First Claim
1. A method of forming sensor packages comprising:
- providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters, and said sensor wafer including first bond pads formed on said first side outside of said areas delineated by said first bonding perimeters;
providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and second bond pads, and said fourth side including second bonding perimeters;
bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages;
removing portions of said controller wafer to reveal said first bond pads formed on said first side of said sensor wafer;
attaching bond wires between corresponding ones of said first and second bond pads; and
singulating said stacked wafer structure to produce said sensor packages.
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0 Petitions
Accused Products
Abstract
A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).
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Citations
15 Claims
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1. A method of forming sensor packages comprising:
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providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters, and said sensor wafer including first bond pads formed on said first side outside of said areas delineated by said first bonding perimeters; providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and second bond pads, and said fourth side including second bonding perimeters; bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages; removing portions of said controller wafer to reveal said first bond pads formed on said first side of said sensor wafer; attaching bond wires between corresponding ones of said first and second bond pads; and singulating said stacked wafer structure to produce said sensor packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming sensor packages comprising:
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providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters; providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and said fourth side including second bonding perimeters; bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages; applying a packaging material over said third side of said controller wafer to encapsulate said control circuitry; and singulating said stacked wafer structure to produce said sensor packages, said singulating operation being performed following said applying operation.
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13. A method of forming sensor packages comprising:
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providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters, and said first side further including first bond pads positioned outside of said areas; providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and second bond pads, and said fourth side including second bonding perimeters; bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages; removing portions of said controller wafer to reveal said first bond pads formed on said first side of said sensor wafer; attaching bond wires between corresponding ones of said first and second bond pads; applying a packaging material over said third side of said controller wafer to encapsulate said control circuitry and said bond wires; and following said applying operation, singulating said stacked wafer structure to produce said sensor packages. - View Dependent Claims (14, 15)
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Specification