High density multi-chip LED devices

• US 9,041,042 B2
• Filed: 01/31/2011
• Issued: 05/26/2015
• Est. Priority Date: 09/20/2010
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Rosado, Raymond, Laughner, Michael P., Emerson, David T., Abare, Amber C., Britt, Jeffrey C.
• Primary Examiner(s): Fan, Michele
• Application Number:
  US13/017,502
• Publication Number:
  US 20120068198A1
• Time in Patent Office: 1,576 Days
• Field of Search: 257/79, 257/99, 257/100, 257E33056-E33059, 438 26- 28, 438/34, 438/22
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Claims

1. An LED device comprising:

a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal;

at least two groups of LED chips fixed to the submount wherein all the LED chips within a group are connected in parallel to one of the at least two semicircular areas of metal; and

a plurality of wire bonds, each connected between an LED chip from among the at least two groups of LED chips and the submount, the plurality of wire bonds arranged so that all the wire bonds are disposed on the outside of at least one group of the at least two groups of LED chips and the groups of LED chips are connected in series.

2. The LED device of claim 1 wherein each group comprises six LED chips.

3. The LED device of claim 1 wherein at least one group of LED chips includes LED chips of at least two different sizes.

4. The LED device of claim 3 wherein one size of LED chips is about 1000 microns square and another size of LED chips is about 700 microns or less square.

5. The LED device of claim 3 where one size of LED chips is a vertical LED chip and another size of LED chips is a sideview LED chip.

6. The LED device of claim 1 wherein each group comprises seven LED chips approximately equal in size.

7. The LED device of claim 1 wherein each group comprises eight LED chips.

8. The LED device of claim 1 further comprising an optical element disposed to affect light from the LED chips.

9. A method of assembling a high-density LED device, the method comprising:

fixing at least two groups of LED chips to a submount, a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal so that all LED chips within a group are connected in parallel to one of the semicircular areas of metal; and

connecting a plurality of wire bonds, each between an LED chip from among the at least two groups of LED chips and the submount so that all the wire bonds are disposed on the outside of at least one group of the at least two of LED chips and the groups of LED chips are connected in series.

10. The method of claim 9 further comprising connecting at least some of the wire bonds from each of the two groups of LED chips to a central bus on the base.

11. The method of claim 10 further comprising making the base from alumina.

12. The method of claim 10 further comprising making the base from aluminum nitride.

13. The method of claim 10 wherein at least one group of LED chips includes LED chips of two different sizes.

14. The method of claim 10 further comprising attaching a lens to affect light from the LED chips.

15. An LED device comprising:

a submount comprising a base and a patterned metal layer on the base, the patterned metal layer further including at least two semicircular areas of metal;

at least two groups of LED chips fixed to the submount wherein all the LED chips within a group are connected in parallel to one of the at least two semicircular areas of metal, and each of the LED chips within the group has a first terminal connected to the one semicircular area of metal to which the LED chips within the group are fastened; and

a plurality of wire bonds, each connected between a second terminal of an LED chip from among the at least two groups of LED chips and the submount, the plurality of wire bonds arranged so that all the wire bonds are disposed on the outside of at least one group of the at least two groups of LED chips and the groups of LED chips are connected in series.

16. The LED device of claim 15 wherein each group comprises six LED chips.

17. The LED device of claim 15 wherein at least one group of LED chips includes LED chips of at least two different sizes.

18. The LED device of claim 17 wherein one size of LED chips is about 1000 microns square and another size of LED chips is about 700 microns or less square.

19. The LED device of claim 17 where one size of LED chips is a vertical LED chip and another size of LED chips is a sideview LED chip.

20. The LED device of claim 15 wherein each group comprises seven LED chips approximately equal in size.

21. The LED device of claim 15 wherein each group comprises eight LED chips.