Multilayered circuit type antenna package

• US 9,041,074 B2
• Filed: 06/22/2012
• Issued: 05/26/2015
• Est. Priority Date: 10/19/2011
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Goudelev, Alexander, Kim, Young-hwan, Hong, Won-bin, Baek, Kwang-hyun
• Primary Examiner(s): Loke, Steven
• Assistant Examiner(s): Rhodes, Juanita B
• Application Number:
  US13/531,120
• Publication Number:
  US 20130099389A1
• Time in Patent Office: 1,068 Days
• Field of Search: 257/275, 257/728, 343/700.MS
• US Class Current: 257/275
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 21/0025 Modular arrays

Abstract

A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.

Claims

1. A multilayered antenna package comprising:

a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal;

a first dielectric layer that is disposed directly on a surface of the RFIC interface layer;

a coplanar waveguide layer that is disposed above the first dielectric layer and is configured to receive the RF signal transmitted by the RFIC interface layer;

a second dielectric layer disposed on the coplanar waveguide layer; and

an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer,

wherein the coplanar waveguide layer comprises a signal line and a grounding portion, and the signal line and the grounding portion are disposed on a same plane above the first dielectric layer,

wherein the RFIC interface layer and the antenna portion function as shields to the coplanar waveguide layer.

2. The multilayered antenna package of claim 1, wherein the grounding portion is separated from the signal line.

3. The multilayered antenna package of claim 2, wherein the grounding portion surrounds the signal line with an interval from the signal line.

4. The multilayered antenna package of claim 2, wherein a first end of the signal line is electrically coupled to the RFIC interface layer, and a second end of the signal line is electrically coupled to the antenna portion.

5. The multilayered antenna package of claim 4, wherein the first dielectric layer is disposed on an upper surface of the RFIC interface layer, and the multilayered antenna package further comprises a conductive via that passes through the first dielectric layer to connect the first end of the signal line to the RFIC layer.

6. The multilayered antenna package of claim 5, further comprising:

a third dielectric layer disposed under the RFIC interface layer; and

a power line disposed on a lower surface of the third dielectric layer.

7. The multilayered antenna package of claim 6, wherein the first dielectric layer, the second dielectric layer, and the third dielectric layer are formed of a FR4 material.

8. The multilayered antenna package of claim 4, further comprising:

a power line disposed on the first dielectric layer; and

a third dielectric layer disposed on the power line, wherein the power line and the third dielectric layer are interposed between the coplanar waveguide layer and the first dielectric layer.

9. The multilayered antenna package of claim 8, further comprising a conductive via that passes through the first dielectric layer and the third dielectric layer to connect the RFIC interface layer and the first end of the signal line.

10. The multilayered antenna package of claim 8, wherein the first dielectric layer, the second dielectric layer, and the third dielectric layer are formed of a FR4 material.

11. The multilayered antenna package of claim 2, wherein the signal line supplies a signal from the RFIC interface layer to the antenna portion via a direct feeding method or a coupling feeding method.

12. The multilayered antenna package of claim 1, wherein the antenna portion is configured to irradiate a signal of a millimeter wavelength band.

13. The multilayered antenna package of claim 1, wherein the antenna portion comprises an array of a plurality of antennas.

14. The multilayered antenna package of claim 13, wherein the coplanar waveguide layer comprises a plurality of signal lines corresponding to the plurality of antennas and the grounding portion formed to surround the plurality of signal lines with an interval from the plurality of signal lines.

15. The multilayered antenna package of claim 1, further comprising a heat sink.

16. A multilayered antenna package comprising:

a first dielectric layer;

a coplanar waveguide layer disposed directly on an upper surface of the first dielectric layer;

a radio frequency integrated circuit (RFIC) interface layer that is disposed directly on a lower surface of the first dielectric layer;

at least one first connection via that electrically connects the RFIC interface layer to the coplanar waveguide layer through the first dielectric layer;

a second dielectric layer disposed directly on an upper surface of the coplanar waveguide layer;

an antenna portion that is disposed directly on an upper surface of the second dielectric layer; and

at least one second connection via that electrically connects the coplanar waveguide layer to the antenna portion through the second dielectric layer,

wherein the coplanar waveguide layer comprises a signal line and a grounding portion, and the signal line and the grounding portion are disposed on a same plane of the first dielectric layer,

wherein the RFIC interface layer and the antenna portion function as shields to the coplanar waveguide layer.

17. The multilayered antenna package according to claim 16, wherein the ground that surrounds the signal line, and the first connection via is electrically connected to a first end of the signal line, and the second connection via is electrically connected to a second end of the signal line.

18. The multilayered antenna package according to claim 16, further comprising:

a third dielectric layer disposed directly on a lower surface of the RFIC layer;

a power line disposed directly on a lower surface of the third dielectric layer; and

at least one third connection via that electrically connects the power line to the RFIC layer through the third dielectric layer.