Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods

• US 9,041,448 B2
• Filed: 03/05/2013
• Issued: 05/26/2015
• Est. Priority Date: 03/05/2013
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Du, Yang, Xie, Jing, Samadi, Kambiz
• Primary Examiner(s): NGUYEN, LONG T
• Application Number:
  US13/784,915
• Publication Number:
  US 20140253196A1
• Time in Patent Office: 812 Days
• Field of Search: 327/199, 327/202, 327/203, 327210-212, 327/215, 327/218, 327/219, 327564-566
• US Class Current: 327/202
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03K 3/0372 of the master-slave type

Abstract

Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC)(3DIC) and related method are disclosed. In one embodiment, a single clock source is provided for the 3DIC and distributed to elements within the 3DIC. Delay is provided to clock paths by selectively controllable flip-flops to help provide synchronous operation. In certain embodiments, 3D flip-flop are provided that include a master latch disposed in a first tier of a 3DIC. The master latch is configured to receive a flip-flop input and a clock input, the master latch configured to provide a master latch output. The 3D flip-flop also includes at least one slave latch disposed in at least one additional tier of the 3DIC, the at least one slave latch configured to provide a 3DIC flip-flop output. The 3D flip-flop also includes at least one monolithic intertier via (MIV) coupling the master latch output to an input of the slave latch.

Claims

1. A three-dimensional (3D) flip-flop, comprising:

a master latch disposed in a first tier of a 3D integrated circuit (IC) (3DIC), the master latch configured to receive a flip-flop input and a clock input, the master latch configured to provide a master latch output;

at least one slave latch disposed in at least one additional tier of the 3DIC, the at least one slave latch configured to provide a 3DIC flip-flop output; and

at least one monolithic intertier via (MIV) coupling the master latch output to an input of the at least one slave latch.

2. The 3D flip-flop of claim 1, wherein the at least one slave latch comprises a plurality of slave latches.

3. The 3D flip-flop of claim 2, wherein a first of the plurality of slave latches is on the at least one additional tier of the 3DIC and a second of the plurality of slave latches is on a second additional tier of the 3DIC.

4. The 3D flip-flop of claim 1, further comprising a clock source configured to provide the clock input and to provide an input to an enable input on the at least one slave latch.

5. The 3D flip-flop of claim 1, wherein the first tier comprises a material that is electrically faster than a material forming the at least one additional tier.

6. The 3D flip-flop of claim 1, wherein the first tier comprises a material that is electrically slower than a material forming the at least one additional tier.

7. The 3D flip-flop of claim 1 integrated into a semiconductor die.

8. The 3D flip-flop of claim 1 integrated into a device selected from the group consisting of:

a set top box, an entertainment unit, a navigation device, a communications device, a fixed location data unit, a mobile location data unit, a mobile phone, a cellular phone, a computer, a portable computer, a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, and a portable digital video player, into which the 3D flip-flop is integrated.

9. A three-dimensional (3D) flip-flop, comprising:

a master means for latching disposed in a first tier of a 3D integrated circuit (IC) (3DIC), the master means for latching configured to receive a flip-flop input and a clock input and the master means configured to provide a master latch output;

at least one slave means for latching disposed in at least one additional tier of the 3DIC, the at least one slave means for latching configured to provide a 3DIC flip-flop output; and

at least one monolithic intertier via (MIV) coupling the master latch output to an input of the at least one slave means.

10. The 3D flip-flop of claim 9, wherein the at least one slave means for latching comprises a plurality of slave latches.

11. The 3D flip-flop of claim 10, wherein a first of the plurality of slave latches is on the at least one additional tier of the 3DIC and a second of the plurality of slave latches is on a second additional tier of the 3DIC.

12. The 3D flip-flop of claim 9, further comprising a means for clocking configured to provide the clock input and to provide an input to an enable input on the at least one slave means.

13. The 3D flip-flop of claim 9, wherein the first tier comprises a material that is electrically faster than a material forming the at least one additional tier.

14. The 3D flip-flop of claim 9, wherein the first tier comprises a material that is electrically slower than a material forming the at least one additional tier.

15. A method of forming a three-dimensional (3D) integrated circuit (IC) (3DIC), comprising:

providing a master latch on a first tier of the 3DIC;

providing a slave latch on a second tier of the 3DIC wherein the second tier is different from the first tier; and

coupling the master latch to the slave latch with at least one monolithic intertier via (MIV).

16. The method of claim 15, wherein coupling the master latch to the slave latch comprises coupling a master latch output to the at least one MIV.

17. The method of claim 15, further comprising positioning the master latch and the slave latch as a hard macro during the a design phase.

18. The method of claim 15, wherein coupling the master latch to the slave latch comprises coupling an input of the slave latch to the at least one MIV.

19. The method of claim 15, further comprising providing a flip-flop output for the slave latch.

20. The method of claim 15, further comprising forming the first tier from a material that is electrically faster than a material used to form the second tier.