Grounded lid for micro-electronic assemblies
First Claim
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1. An apparatus for reducing EMI at the micro-electronic-component level, the apparatus comprising:
- a substrate having a ground conductor integrated therein;
a micro-electronic component mounted to the substrate;
an electrically conductive lid mounted to the substrate and thereby forming a physical interface with the substrate, the electrically conductive lid substantially covering the micro-electronic component;
a conductive link creating an electrical connection between the electrically conductive lid and the ground conductor at the physical interface, the conductive link comprising a first solder layer on the ground conductor, a second solder layer on the electrically conductive lid, and an electrically conductive adhesive between the first and second solder layers; and
one or more gaps in the electrically conductive adhesive.
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Abstract
An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
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Citations
10 Claims
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1. An apparatus for reducing EMI at the micro-electronic-component level, the apparatus comprising:
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a substrate having a ground conductor integrated therein; a micro-electronic component mounted to the substrate; an electrically conductive lid mounted to the substrate and thereby forming a physical interface with the substrate, the electrically conductive lid substantially covering the micro-electronic component; a conductive link creating an electrical connection between the electrically conductive lid and the ground conductor at the physical interface, the conductive link comprising a first solder layer on the ground conductor, a second solder layer on the electrically conductive lid, and an electrically conductive adhesive between the first and second solder layers; and one or more gaps in the electrically conductive adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification