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Power inverter including a power semiconductor module

  • US 9,042,147 B2
  • Filed: 12/22/2011
  • Issued: 05/26/2015
  • Est. Priority Date: 12/27/2010
  • Status: Active Grant
First Claim
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1. A power inverter comprising:

  • a power module that includes a power semiconductor device inverting a DC current into an AC current;

    a control circuit board that outputs a control signal used for controlling the power semiconductor device;

    a driver circuit board that outputs a driving signal used for driving the power semiconductor device based on the control signal;

    a conductive base plate arranged in a space between the driver circuit board and the control circuit board in which a wiring opening portion is formed;

    a control wiring that connects the driver circuit board and the control circuit board through the wiring opening portion and delivers the control signal to the driver circuit board;

    a conductive casing of a bottomed cylinder shape that has a casing opening potion closed by one face of the base plate and forms a housing space in which the driver circuit board is arranged;

    a conductive cover body that is fixed to the other face of the base plate and forms a housing space in which the control circuit board is arranged between the base plate and the cover body; and

    an external connector that includes a lead wiring used for being connected to the control circuit board;

    wherein the base plate is fixed to the casing such that the one face is brought into contact with a circumferential edge of the casing opening portion;

    the external connector is arranged such that the lead wiring is connected to the control circuit board through a space between the control circuit board and the base plate;

    a wall portion surrounding a periphery of the control circuit board is integrally formed on the base plate; and

    a housing space in which the control circuit board is arranged is formed by fixing the cover body to an upper end of the wall portion.

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