Semiconductor light emitting apparatus including bulb and screw-type base

• US 9,046,248 B2
• Filed: 12/19/2012
• Issued: 06/02/2015
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Edmond, John Adam
• Primary Examiner(s): Ho, Anthony
• Application Number:
  US13/720,193
• Publication Number:
  US 20130107522A1
• Time in Patent Office: 895 Days
• Field of Search: 313/488
• US Class Current: 1/1
• CPC Class Codes: F21K 9/61 using light guides
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0003 the light guides being doped with fluorescent agents
• CPC Class Codes: G02B 6/001 the light being emitted along at least a portion of the lateral surface of the fibre
• CPC Class Codes: G02B 6/0035 provided on the surface of the light guide or in the bulk of it
• CPC Class Codes: G02B 6/005 provided by one optical element, or plurality thereof, placed on the light output side of the light guide
• CPC Class Codes: G02B 6/0096 the lights guides being of the hollow type

Abstract

A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that includes an elongated wavelength conversion tube wall having wavelength conversion material, such as phosphor, dispersed therein. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein. The elongated hollow wavelength conversion tube may have an open end, a crimped end, a reflective end, and/or other configurations. Multiples tubes and/or multiple semiconductor light emitting devices may also be used in various configurations. Related assembling methods are also described.

Claims

1. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base;

a plurality of semiconductor light emitting devices in the bulb that face one another; and

voltage conversion circuits for the plurality of semiconductor light emitting devices.

2. An apparatus according to claim 1 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.

3. An apparatus according to claim 2 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.

4. An apparatus according to claim 2 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.

5. An apparatus according to claim 1 wherein the base comprises a screw-type base.

6. An apparatus according to claim 1 further comprising a thermal management system for the plurality of semiconductor light emitting devices.

7. An apparatus according to claim 6 wherein the thermal management system comprises at least one heat sink.

8. An apparatus according to claim 7 wherein the at least one heat sink comprises at least one thermally conductive standoff.

9. An apparatus according to claim 1 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb.

10. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base;

first and second light emitting diodes in the bulb that face one another;

first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes; and

a reflector between a respective light emitting diode and a respective heat sink.

11. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base; and

a plurality of semiconductor light emitting devices in the bulb that face one another,

wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the domes of the plurality of semiconductor light emitting devices face one another.

12. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base; and

a plurality of semiconductor light emitting devices in the bulb that face inwardly into the bulb,

wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the plurality of semiconductor light emitting devices emit light inwardly into the bulb through the respective dome.

13. An apparatus according to claim 12 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.

14. An apparatus according to claim 13 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.

15. An apparatus according to claim 13 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.

16. An apparatus according to claim 12 wherein the base comprises a screw-type base.

17. An apparatus according to claim 12 further comprising a thermal management system for the plurality of semiconductor light emitting devices.

18. An apparatus according to claim 17 wherein the thermal management system comprises at least one heat sink.

19. An apparatus according to claim 18 wherein the at least one heat sink comprises at least one thermally conductive standoff.

20. An apparatus according to claim 12 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb.

21. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base;

a plurality of semiconductor light emitting devices in the bulb that face inwardly into the bulb; and

voltage conversion circuits for the plurality of semiconductor light emitting devices.

22. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base;

first and second light emitting diodes in the bulb that face inwardly into the bulb;

first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes; and

a reflector between a respective light emitting diode and a respective heat sink.

23. A semiconductor light emitting apparatus comprising:

a base;

a bulb that is connected to the base to define a central axis of the semiconductor light emitting apparatus;

a plurality of semiconductor light emitting devices in the bulb that are offset from, and face, the central axis of the semiconductor light emitting apparatus; and

voltage conversion circuits for the plurality of semiconductor light emitting devices.

24. An apparatus according to claim 23 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.

25. An apparatus according to claim 24 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.

26. An apparatus according to claim 24 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.

27. An apparatus according to claim 26 further comprising a reflector between a respective light emitting diode and a respective heat sink.

28. An apparatus according to claim 23 wherein the base comprises a screw-type base.

29. An apparatus according to claim 23 further comprising a thermal management system for the plurality of semiconductor light emitting devices.

30. An apparatus according to claim 29 wherein the thermal management system comprises at least one heat sink.

31. An apparatus according to claim 30 wherein the at least one heat sink comprises at least one thermally conductive standoff.

32. An apparatus according to claim 29 wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the plurality of semiconductor light emitting devices emit light through the respective dome towards the axis of the semiconductor light emitting apparatus.

33. An apparatus according to claim 23 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb.