Thin flash or video recording light using low profile side emitting LED

• US 9,046,634 B2
• Filed: 06/14/2007
• Issued: 06/02/2015
• Est. Priority Date: 06/14/2007
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Philips Lumileds Lighting Company LLC (Apollo Global Management, Inc.)
• Inventors: Shchekin, Oleg Borisovich, Epler, John, Eng, Gregory W., Bierhuizen, Serge, Harbers, Gerard
• Primary Examiner(s): SAYADIAN, HRAYR
• Application Number:
  US11/763,311
• Publication Number:
  US 20080308824A1
• Time in Patent Office: 2,910 Days
• Field of Search: 257/98, 257/99, 257/E33.061, 257/E33.067, 257/E33.068, 257/E33.071, 257/E33.073, 257/E33.074, 364/84, 364/606, 364/610, 364/612, 364/614, 364/615
• US Class Current: 1/1
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/013 Alloys
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector

Abstract

Very thin flash modules for cameras are described that do not appear as a point source of light to the illuminated subject. Therefore, the flash is less objectionable to the subject. In one embodiment, the light emitting surface area is about 5 mm×10 mm. Low profile, side-emitting LEDs optically coupled to solid light guides enable the flash module to be thinner than 2 mm. The flash module may also be continuously energized for video recording. The module is particularly useful for cell phone cameras and other thin cameras.

Claims

1. A device comprising:

a side-emitting, none-lasing light emitting diode (LED) die, the LED die comprising;

a first semiconductor layer of a first type;

a second semiconductor layer of a second type;

an active layer between the first semiconductor layer and second semiconductor layer, the active layer having a major surface;

a first electrode in contact with the semiconductor layer;

a second electrode in contact with the second semiconductor layer, the first electrode and the second electrode being on a first side of the LED die so that the LED die is a flip chip;

a second side of the LED die, opposite the first side of the LED die, wherein a growth substrate has been removed from the second side;

a uniform reflective film formed on the second side of the LED die without an air gap between the LED die and the reflective film, the reflective film forming a reflector substantially parallel to the major surface of the active layer, such that all light impinging on the reflector is redirected back into the LED die, the LED die only emitting light from its sides, wherein no lens is employed for causing the LED die to emit all of its light from its sides;

a solid light guide having a top surface through which light is emitted, the light guide having a cavity, of approximate dimensions as the LED die, in which the side-emitting LED die is positioned, whereby light emitted from the sides of the LED die is optically coupled into the light guide;

a reflector layer on a bottom surface of the light guide and covering the cavity;

a reflector around side walls of the solid light guide;

a submount supporting the LED die;

a metal support structure, connected to the submount and the light guide, that acts as a heat sink for the LED die;

a driver electrically connected to the first electrode and the second electrode of the LED die for supplying power to the led die to illuminate a subject for recording an image of the subject; and

a camera, the LED die and driver being mounted within the camera,

wherein the first side of the LED die faces the same direction as the top surface of the light guide, and wherein the submount and the metal support structure are located above the top surface of the light guide.

2. The device of claim 1 wherein the camera is a still picture camera, and the driver is configured for controlling the LED die to output a flash for taking a still picture of the subject.

3. The device of claim 1 wherein the camera is a video camera, and the driver is configured for controlling the LED to continuously output light for taking a video recording of the subject.

4. The device of claim 1 wherein the active layer and a bottom surface of the reflector are located between a top surface plane and a bottom surface plane of the light guide.

5. The device of claim 1 wherein the light guide has a thickness less than 2 mm.

6. The device of claim 1 wherein the LED die has a thickness less than 2 mm.

7. The device of claim 1 wherein the LED die further comprises a phosphor layer between the reflector and the second semiconductor layer.

8. The device of claim 7 wherein the LED die, including the phosphor layer, emits white light.

9. The device of claim 1 wherein light emitting sides of the LED die have a height less than 0.4 mm.

10. The device of claim 1 wherein the active layer emits blue light.

11. The device of claim 1 wherein the bottom surface of the light guide scatters light toward the top surface.

12. The device of claim 1 wherein the top surface of the light guide has a light emitting surface area greater than 25 square millimeters.

13. The device of claim 1 wherein the top surface of the light guide has a light emitting surface area greater than 50 square millimeters.

14. The device of claim 1 wherein the LED die is part of a flash module.

15. The device of claim 1 further comprising a plurality of side emitting in respective openings in the light guide.

16. The device of claim 1 wherein the camera is a cell phone camera.

17. The device of claim 1 further comprising a brightness enhancing layer over the light guide for directing the light emitted by the light guide toward the subject being illuminated.