EUV mask inspection system
First Claim
1. A mask inspection system comprising:
- an extreme ultraviolet (EUV) light source configured to direct an EUV radiation beam to a diverter device;
the diverter device configured to direct the EUV radiation beam onto a target portion of a first mask being used only in the mask inspection device and substantially simultaneously direct the EUV radiation beam onto a second mask being used only in a wafer patterning device of a lithographic apparatus;
an optical system configured to receive at least a portion of a reflected EUV radiation beam from the of target portion of the first mask;
an image sensor configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam; and
a data analysis device configured to analyze the aerial image for mask defects.
1 Assignment
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Accused Products
Abstract
Disclosed are apparatuses, methods, and lithographic systems for EUV mask inspection. An EUV mask inspection system can include an EUV illumination source, an optical system, and an image sensor. The EUV illumination source can be a standalone illumination system or integrated into the lithographic system, where the EUV illumination source can be configured to illuminate an EUV radiation beam onto a target portion of a mask. The optical system can be configured to receive at least a portion of a reflected EUV radiation beam from the target portion of the mask. Further, the image sensor can be configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam. The EUV mask inspection system can also include a data analysis device configured to analyze the aerial image for mask defects.
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Citations
14 Claims
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1. A mask inspection system comprising:
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an extreme ultraviolet (EUV) light source configured to direct an EUV radiation beam to a diverter device; the diverter device configured to direct the EUV radiation beam onto a target portion of a first mask being used only in the mask inspection device and substantially simultaneously direct the EUV radiation beam onto a second mask being used only in a wafer patterning device of a lithographic apparatus; an optical system configured to receive at least a portion of a reflected EUV radiation beam from the of target portion of the first mask; an image sensor configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam; and a data analysis device configured to analyze the aerial image for mask defects. - View Dependent Claims (2, 3, 4, 5)
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6. A method, comprising:
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illuminating an extreme ultraviolet (EUV) radiation beam onto a target portion of a mask being used only in a mask inspection device; substantially simultaneously illuminating the EUV radiation beam onto a second mask being used only in a wafer patterning device of a lithographic apparatus; receiving at least a portion of a reflected EUV radiation beam from the target portion of the first mask; detecting an aerial image corresponding to the portion of the reflected EUV radiation beam; and analyzing the aerial image for mask defects. - View Dependent Claims (7, 8, 9, 10)
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11. A system, comprising:
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an extreme ultraviolet (EUV) light source configured to direct an EUV radiation beam to a diverter device; the diverter device configured to switch between directing the EUV radiation beam onto a target portion of a first patterning device in a mask inspection device and directing the EUV radiation beam onto a second patterning device in a wafer patterning device of a lithographic apparatus; an optical system configured to receive at least a portion of a reflected EUV radiation beam from the target portion of the first patterning device; an image sensor configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam; and a data analysis device configured to analyze the aerial image for mask defects.
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12. A lithography system, comprising:
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an extreme ultraviolet (EUV) light source configured to direct an extreme ultraviolet (EUV) radiation beam to a diverter; the diverter device configured to switch between directing the EUV radiation beam onto a target portion of a first patterning device in a mask inspection device and directing the EUV radiation beam onto a second patterning device in a wafer patterning device of a lithographic apparatus; a support constructed to support the second patterning device, the second patterning device configured to impart the EUV radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; a projection system configured to focus the patterned radiation beam onto the substrate; and the mask inspection system comprising, an optical system configured to receive at least a portion of a reflected EUV radiation beam from the target portion of the first patterning device, an image sensor configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam, and a data analysis device configured to analyze the aerial image for mask defects. - View Dependent Claims (13, 14)
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Specification