Method for monitoring focus on an integrated wafer

• US 9,046,788 B2
• Filed: 05/19/2008
• Issued: 06/02/2015
• Est. Priority Date: 05/19/2008
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Gabor, Allen H., Li, Wai-Kin
• Primary Examiner(s): Ton, Toan
• Assistant Examiner(s): Persaud, Deoram
• Application Number:
  US12/122,929
• Publication Number:
  US 20090284722A1
• Time in Patent Office: 2,570 Days
• Field of Search: 355/52, 355/53, 355/55, 355/77, 382/145
• US Class Current: 1/1
• CPC Class Codes: G03F 7/70333 Focus drilling, i.e. increase in depth of focus for exposure by modulating focus during exposure [FLEX]
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70641 Focus

Abstract

A method and apparatus are provided for improving the focusing of a substrate such as a wafer during the photolithography imaging procedure of a semiconductor manufacturing process. The invention is particularly useful for step-and-scan system and the CD of two features in each exposure field are measured in fields exposed at varying focus to form at least two Bossung curves. Exposure focus instructions are calculated based on the intersection point of the curves and the wafer is then scanned and imaged based on the calculated exposure focus instructions. In another aspect of the invention, when multiple wafers are being processed operational variances may cause a drift in the focus. The focus drift can be easily corrected by measuring the critical dimension of each of the features and comparing the difference to determine if any focus offset is needed to return the focus to the original calculated focus value.

Claims

1. A method of monitoring focus during photolithography on a wafer comprising the steps of:

loading a wafer and a patterned reticle into a step-and-scan wafer imaging photolithography exposure system;

exposing the reticle using the step-and-scan system using a same dose but a varying focus for each exposure field of the reticle pattern on the wafer;

measuring the critical dimensions of two different features in two different regions in each exposure field, the features and regions being the same in each exposure field, the two different regions being positioned in each exposure field so that the step-and-scan wafer imaging photolithography exposure system cannot expose both of them at best focus;

plotting Bossung curves of critical dimension versus focus for the two different features in the two different regions;

determining a first best focus for the first of the two different features and a second best focus for the second of the two different features;

correlating the first and second best focuses with each other to determine their intersection point which comprises a best focus of the exposure field;

plotting the critical dimension difference between the Bossung curves for the two different features in the two different regions versus focus shift using data from the Bossung curves of the two different features and the best focus of the exposure field to obtain a sloped plot;

determining if the difference plot has sufficient sensitivity to be used as a focus monitor by determining whether the sloped plot has a desired minimum slope needed for the sloped plot to be used as the focus monitor, and if the sloped plot does not have the desired minimum slope to meet sufficient sensitivity, choosing new features in two different regions and repeating the measuring, best focus determination, correlating and plotting steps until sufficient sensitivity for use as a focus monitor is achieved;

determining focus instruction values based on the difference plot focus monitor;

scanning and exposing a new wafer based on the determined focus instruction values.

2. The method of claim 1 further including determining if the exposure system focus instruction value has drifted by exposing a new wafer to create exposure fields at a different focus based on the focus instruction values, again measuring critical dimension of a feature in two different regions in each exposure field to create new Bossung curves, plotting the difference between the new Bossung curves, determining if the difference between the new Bossung curves has changed compared to the difference between the previous Bossung curves, and adjusting if necessary the focus instruction values based on the difference between the new Bossung curves.

3. The method of claim 2 wherein a correlation is made between the difference between the critical dimension for each feature versus focus shift and the focus instruction values based on the correlation are adjusted.

4. The method of claim 3 wherein, for a first feature A in a first region on an exposure field and for a second feature B in a second region on the exposure field, if the critical dimension for feature B is less than the critical dimension of feature A the focus instruction value is increased.

5. The method of claim 3 wherein, for a first feature A in a first region on an exposure field and for a second feature B in a second region on the exposure field, if the critical dimension for feature B is greater than the critical dimension for feature A the focus instruction value is decreased.

6. The method of claim 1 wherein the determined focus instruction value may vary up to ±

10%.

7. The method of claim 1 wherein the determined focus instruction value may vary up to ±

200nm.

8. The method of claim 1 wherein the desired minimum slope comprises a predetermined desired minimum slope defined by an end-user.

9. The method of claim 1 wherein the sensitivity is defined as the sloped plot having a positive or negative slope, whereby the greater the slope, the greater the sensitivity.

10. The method of claim 1 further including storing the difference plot data in a look-up table.

11. The method of claim 10 further including determining if the exposure system focus instruction value has drifted by exposing a new wafer based on the focus instruction values to create exposure fields at a different focus, again measuring critical dimension of a feature in two different regions in each exposure field to create new Bossung curves, plotting the difference between the new Bossung curves, and using the look-up table determining if the difference between the new Bossung curves has changed compared to the difference between the previous Bossung curves stored in the look-up table, and adjusting if necessary the focus instruction values based on the difference between the new Bossung curve.

12. The method of claim 10 further including determining if the exposure system focus instruction value has drifted by exposing a lot of wafers based on the focus instruction values to create exposure fields at a different focus, again measuring critical dimension of a feature in two different regions in each exposure field to create new Bossung curves, plotting the difference between the new Bossung curves, and using the look-up table determining if the difference between the new Bossung curves has changed compared to the difference between the previous Bossung curves stored in the look-up table, and adjusting if necessary the focus instruction values based on the difference between the new Bossung curve.

13. The method of claim 1 wherein the best focus of the exposure field is monitored and maintained in a feedback loop during the exposure process so that each wafer receives the best focus process conditions known based on recently exposed wafers.

20. The apparatus of claim 8 wherein the adjustment apparatus decreases the focus instruction value if the critical dimension for feature B is greater than the critical dimension of feature A.

14. An apparatus for making an integrated circuit device comprising a wafer wherein photolithography means are used to image the wafer during the making of the integrated circuit device comprising:

a loading apparatus for loading a wafer and a patterned reticle into a step-and-scan wafer imaging photolithography exposure system;

the photolithography exposure system including an exposure apparatus to expose the reticle using a same dose but a varying focus exposure field for each reticle pattern on the wafer;

a measuring apparatus to measure the critical dimension of a feature in two different regions in each exposure field, the features and regions being the same in each exposure field, the two different regions being positioned in each exposure field so that the step-and-scan wafer imaging photolithography exposure system cannot expose both of them at best focus;

a plotting apparatus to plot a Bossung curve of critical dimension versus focus for the two different features in the two different regions;

a best focus determining and correlating apparatus to determine a best focus for each of the two different features, and to correlate these best focuses of the two different features with each other to determine their intersection point which comprises a best focus of the exposure field;

a plotting apparatus for plotting the critical dimension difference between the critical dimension for the two different features in the two different regions regions versus focus shift using data from the Bossung curves of the two different features and the best focus of the exposure field to obtain a sloped plot;

a difference plot sensitivity apparatus for determining if the difference plot has sufficient sensitivity to be used as a focus monitor by determining whether the sloped plot has a desired minimum slope needed for the sloped plot to be used as the focus monitor, and if the sloped plot does not have the desired minimum slope to meet sufficient sensitivity, choosing new features in two different regions and repeating the measuring, best focus determination, correlating and plotting steps until sufficient sensitivity for use as a focus monitor is achieved;

a focus determination apparatus to determine a focus instruction value for the exposure fields based on the above plots;

a scanning and imaging apparatus for scanning and imaging the wafer based on the determined focus instruction value; and

a release apparatus for releasing the wafer and unloading the wafer from the exposure system.

15. The apparatus of claim 14 wherein the focus determination apparatus varies the determined focus instruction value up to ±

200 nm.

16. The apparatus of claim 14 which is used to monitor the focus of each scan during use of the apparatus to scan multiple wafers further comprising:

an exposing apparatus to expose a new wafer to create exposure fields at different focus based on the focus instruction values;

a measuring apparatus to measure the critical dimension for feature A and feature B;

a calculating apparatus to calculate the difference between the critical dimension of a feature in each exposure field to create new Bossung curves;

a plotting apparatus to plot the difference between the new Bossung curves;

a determining apparatus to determine if the difference between the new Bossung curves has changed compared to the difference between the previous Bossung curves;

an adjusting apparatus to adjust the focus instruction value if necessary based on the difference;

a scanning and exposing apparatus to scan and expose the next wafer based on the adjusted focus instruction values; and

continuing the above steps until the scanning and exposing of each wafer is completed.

17. The apparatus of claim 16 wherein a correlation apparatus is used to form a correlation between the difference between the critical dimension for each feature of the scan position versus focus shift and adjusting the focus instruction value based on the correlation.

18. The apparatus of claim 17 wherein the focus adjustment apparatus varies the determined focus instruction value up to ±

200 nm.

19. The apparatus of claim 16 wherein the adjustment apparatus increases the focus instruction value if the critical dimension for feature B is less than the critical dimension for feature A.

21. A method of monitoring focus during photolithography on a wafer comprising the steps of:

loading a wafer and a patterned reticle into a photolithography exposure system;

using the photolithography exposure system exposing the various exposure fields across the reticle pattern at a best focus of the photolithography exposure system;

measuring critical dimensions of two different features in two different regions in each exposure field;

plotting Bossung curves of critical dimension versus focus for the two different features in the two different regions;

providing a best focus of the exposure field by determining best focus for each of the two different features followed by correlating these best focuses to obtain their intersection point which comprises the best focus of the exposure field;

plotting a difference plot of the critical dimension difference between the Bossung curves versus focus shift of the best focus of the exposure field to obtain a sloped plot; and

determining whether the sloped plot has a desired minimum slope of the sloped plot which indicates that the best focus of the exposure field has sufficient sensitivity to be used as a focus monitor, and if not, choosing new features in two different regions and repeating the measuring, best focus determination, correlating and plotting steps until sufficient sensitivity for use as a focus monitor is achieved.