Logical cell array and bus system

• US 9,047,440 B2
• Filed: 05/28/2013
• Issued: 06/02/2015
• Est. Priority Date: 10/06/2000
• Status: Expired due to Term

• Current Assignee: Scientia Sol Mentis AG (PACT XPP Schweiz AG)
• Original Assignee: Pact XPP Technologies, AG
• Inventors: Vorbach, Martin, May, Frank, Ehlers, Gerd, Nckel, Armin, Baumgarte, Volker, Oertel, Jens, Reichardt, Dirk, Lier, Frank, Rao, Prashant
• Primary Examiner(s): Tan, Vibol
• Application Number:
  US13/903,470
• Publication Number:
  US 20140359254A1
• Time in Patent Office: 735 Days
• Field of Search: 326 38- 41, 708/490, 708501-505, 708/620, 708/650, 708/670
• US Class Current: 1/1
• CPC Class Codes: G06F 13/4022 using switching circuits, e.g. switching matrix, connection or expansion network G06F13/4009 takes precedence
• CPC Class Codes: G06F 13/4027 using bus bridges G06F13/4022 takes precedence
• CPC Class Codes: G06F 15/7825 Globally asynchronous, locally synchronous, e.g. network on chip
• CPC Class Codes: G06F 15/7867 with reconfigurable architecture
• CPC Class Codes: G06F 15/80 comprising an array of processing units with common control, e.g. single instruction multiple data processors G06F15/82 takes precedence ; for correlation function computation G06F17/15
• CPC Class Codes: G06F 15/8023 Two dimensional arrays, e.g. mesh, torus
• CPC Class Codes: G06F 15/8092 Array of vector units
• CPC Class Codes: G06F 15/82 data or demand driven
• CPC Class Codes: G06F 9/3001 Arithmetic instructions
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A logic cell array having a number of logic cells and a segmented bus system for logic cell communication, the bus system including different segment lines having shorter and longer segments for connecting two points in order to be able to minimize the number of bus elements traversed between separate communication start and end points.

Claims

1. A data processor on a chip comprising:

a plurality of processing array elements disposed in a multi-dimensional array, the processing array elements including a plurality of data processing units comprising arithmetic logic units operative to perform one or more of a plurality of arithmetic operand functions and a plurality of memory units in operative communication with the plurality of arithmetic logic units, wherein the data processing units within a first axis of the multi-dimensional array are in communication with the memory units within the first axis of the multi-dimensional array;

at least one interface unit operative to provide at least one communication channel between the plurality of processing array elements;

a bus system flexibly interconnecting the plurality of processing array elements for multi-directional communication across the bus system among the plurality of processing array elements.

2. The data processor of claim 1, wherein the multi-dimensional array is a two dimensional array, the first axis being a horizontal axis and a second axis, the second axis being a vertical axis.

3. The data processor of claim 1, wherein the multi-dimensional array is a three dimensional array, the first axis being different from a second axis, the first axis and the second axis each being at least one of an X axis, a Y axis and a Z axis.

4. The data processor of claim 1, wherein the bus system includes:

a first structure dedicated for data transfer in the first axis; and

a second structure dedicated for data transfer in a second axis.

5. The method of claim 4, wherein the bus system further includes at least one secondary bus path providing communication between a plurality of the processing array elements.

6. The method of claim 5, wherein the at least one secondary bus path comprises at least one first-in-first-out buffer for transferring data.

7. The method of claim 1, wherein the bus system supports transmission of at least 32-bit wide data.

8. The method of claim 1, wherein the bus system supports transmission of at least 64-bit wide data.

9. The method of claim 1, wherein the at least one interface unit transfers data between the data processor and an external memory in packets.

10. The method of claim 1, wherein the at least one interface unit supports a plurality of data processor internal data channels.

11. A data processor on a chip comprising:

a plurality of processing array elements disposed in a multi-dimensional array, the processing array elements including a plurality of arithmetic logic units operative to perform one or more of a plurality of arithmetic operand functions and a plurality of memory units in operative communication with the plurality of arithmetic logic units;

at least one interface unit operative to provide at least one communication channel between the plurality of processing array elements;

a bus system flexibly interconnecting the plurality of processing array elements for multi-directional communication across the bus system among the plurality of processing array elements.