Semiconductor device with buried gates and method for fabricating the same
First Claim
Patent Images
1. A semiconductor device, comprising:
- a supplementary layer formed over a substrate;
a silicon layer formed over the supplementary layer;
a trench penetrating the supplementary layer and the silicon layer and formed in the substrate;
a gate insulation layer formed along a surface of the trench;
a buried gate formed over the gate insulation layer and filling a portion of the trench; and
a junction region used as source region and drain region formed in the silicon layer and on both sides of the trench, wherein the junction region is spaced apart from the buried gate by at least a thickness of the supplementary layer,wherein a top surface of the buried gate is disposed below a bottom surface of the supplementary layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes a supplementary layer and a silicon layer stacked over a substrate, a trench penetrating the supplementary layer and the silicon layer and formed over the substrate, a gate insulation layer formed along a surface of the trench, and a buried gate formed over the gate insulation layer and filling a portion of the trench.
13 Citations
18 Claims
-
1. A semiconductor device, comprising:
-
a supplementary layer formed over a substrate; a silicon layer formed over the supplementary layer; a trench penetrating the supplementary layer and the silicon layer and formed in the substrate; a gate insulation layer formed along a surface of the trench; a buried gate formed over the gate insulation layer and filling a portion of the trench; and a junction region used as source region and drain region formed in the silicon layer and on both sides of the trench, wherein the junction region is spaced apart from the buried gate by at least a thickness of the supplementary layer, wherein a top surface of the buried gate is disposed below a bottom surface of the supplementary layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 18)
-
-
8. A method for fabricating a semiconductor device, comprising:
-
forming a supplementary layer over the substrate; forming a silicon layer over the supplementary layer; forming a junction region in the silicon layer; forming a trench in the substrate by penetrating the silicon layer and the supplementary layer; forming a gate insulation layer along a surface of the trench; forming a buried gate filling a portion of the trench over the gate insulation layer, wherein the junction region used as source region and drain region is spaced apart from the buried gate by at least a thickness of the supplementary layer, wherein a top surface of the buried gate is disposed below a bottom surface of the supplementary layer. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification