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Package systems having interposers

  • US 9,048,233 B2
  • Filed: 05/26/2010
  • Issued: 06/02/2015
  • Est. Priority Date: 05/26/2010
  • Status: Active Grant
First Claim
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1. A package system comprising:

  • a first interposer comprising;

    a first interconnect structure;

    a first substrate disposed over the first interconnect structure, the first substrate comprising at least one first through silicon via (TSV) structure therein;

    a molding compound material disposed over the first interconnect structure and around the first substrate, the molding compound material being free of direct contact with any first TSV structure formed therein; and

    a second interconnect structure over the first substrate and having metallic lines and at least one dielectric layer; and

    a first integrated circuit disposed over the first interposer, the first integrated circuit being electrically coupled with the at least one first TSV structure through the second interconnect structure and connecting bumps,whereina top surface of the molding compound material is flush with a top surface of the second interconnect structure, anda bottom surface of the molding compound material is flush with a bottom surface of the at least one first TSV structure.

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