Sealed body, light-emitting module and method of manufacturing sealed body

• US 9,048,350 B2
• Filed: 11/27/2012
• Issued: 06/02/2015
• Est. Priority Date: 11/28/2011
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nishido, Yusuke
• Primary Examiner(s): Sefer, A.
• Assistant Examiner(s): NGUYEN, DILINH P
• Application Number:
  US13/686,252
• Publication Number:
  US 20130134570A1
• Time in Patent Office: 917 Days
• Field of Search: 257/680, 257/100, 257/787, 257/794, 313/512
• US Class Current: 1/1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/10 Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

Claims

1. A light-emitting device comprising:

a first substrate;

a second substrate which is capable of transmitting an energy ray and is over the first substrate;

a sealed object between the first substrate and the second substrate;

a sealant surrounding the sealed object, the sealant attaching the first substrate to the second substrate;

a first region overlapped with the sealant, the first region being capable of reflecting part of the energy ray; and

a second region overlapped with the sealant, the second region having lower reflectivity with respect to the energy ray than the first region,

wherein the first region and the second region are alternately provided over the first substrate without overlapping with each other, and

wherein the sealant includes a glass.

2. The light-emitting device according to claim 1, wherein the first region and the second region extend outside the sealant.

3. The light-emitting device according to claim 1,

wherein the sealant comprises a first portion of a large radius of curvature and a second portion of a small radius of curvature, and

wherein a ratio of an area of the second region overlapped with the first portion to an area of the first region overlapped with the first portion is lower than a ratio of an area of the second region overlapped with the second portion to an area of the first region overlapped with the second portion.

4. The light-emitting device according to claim 1,

wherein the first region includes a metal layer, and

wherein the second region includes an insulating layer.

5. The light-emitting device according to claim 1,

wherein the sealed object is at least one of an electronic element, a light-emitting element including a layer containing a light-emitting organic compound, a circuit element, a memory element, and an arithmetic element.

6. The light-emitting device according to claim 1,

wherein the energy ray includes at least one of an electron beam, a light beam, a microwave beam, and an ultrasonic beam.

7. The light-emitting device according to claim 1,

wherein the first substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, or a substrate formed of a prepreg, and

wherein the second substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, a substrate formed of a prepreg, a quartz substrate, a sapphire substrate, or a substrate formed of polyvinyl fluoride.

8. The light-emitting device according to claim 1,

wherein the first region is formed with a single-layer structure or a layered structure of any of a layer including a metal, a layer including an alloy, a layer including a metal nitride, a layer including a metal oxide, a layer including a semiconductor, and a layer including an insulator, and

wherein the second region is formed with a single-layer structure or a layered structure of any of a layer including a metal, a layer including an alloy, a layer including a metal nitride, a layer including a metal oxide, a layer including a semiconductor, and a layer including an insulator.

9. A light-emitting device comprising:

a first substrate;

a second substrate which is capable of transmitting an energy ray and is over the first substrate;

a sealant between the first substrate and the second substrate;

a first region overlapped with the sealant, the first region being capable of reflecting part of the energy ray; and

a second region overlapped with the sealant, the second region having lower reflectivity with respect to the energy ray than the first region,

wherein the first region and the second region are alternately provided over the first substrate without overlapping with each other, and

wherein the sealant includes a glass.

10. The light-emitting device according to claim 9,

wherein the first region and the second region extend outside the sealant.

11. The light-emitting device according to claim 9,

wherein the sealant comprises a first portion of a large radius of curvature and a second portion of a small radius of curvature, and

wherein a ratio of an area of the second region overlapped with the first portion to an area of the first region overlapped with the first portion is lower than a ratio of an area of the second region overlapped with the second portion to an area of the first region overlapped with the second portion.

12. The light-emitting device according to claim 9,

wherein the first region includes a metal layer, and

wherein the second region includes an insulating layer.

13. The light-emitting device according to claim 9,

wherein the energy ray includes at least one of an electron beam, a light beam, a microwave beam, and an ultrasonic beam.

14. The light-emitting device according to claim 9,

wherein the first substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, or a substrate formed of a prepreg, and

wherein the second substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, a substrate formed of a prepreg, a quartz substrate, a sapphire substrate, or a substrate formed of polyvinyl fluoride.

15. The light-emitting device according to claim 9,

wherein the first region is formed with a single-layer structure or a layered structure of any of a layer including a metal, a layer including an alloy, a layer including a metal nitride, a layer including a metal oxide, a layer including a semiconductor, and a layer including an insulator, and

wherein the second region is formed with a single-layer structure or a layered structure of any of a layer including a metal, a layer including an alloy, a layer including a metal nitride, a layer including a metal oxide, a layer including a semiconductor, and a layer including an insulator.