LED package with encapsulant having planar surfaces
DCFirst Claim
1. A lighting package, comprising:
- a solid state light source on a submount;
a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source.
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Abstract
LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.
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Citations
91 Claims
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1. A lighting package, comprising:
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a solid state light source on a submount; a wavelength conversion material layer covering said solid state light source and the top surface of said submount; an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. An emitter package, comprising:
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a solid state light source on a submount; a encapsulant on said submount, said encapsulant having one or more planar surfaces; and a wavelength conversion material layer covering said solid state light source and the top surface of said submount;
a polarity indicator on the bottom surface of said submount. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. An emitter package, comprising:
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a solid state light source on a submount; an encapsulant on said submount, said encapsulant having one or more planar surfaces, wherein said package emits an emission profile that is wider than a package with identical features aside from a encapsulant not having planar surfaces. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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61. An emitter package, comprising:
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a solid state light source on a submount; an encapsulant on said submount, said encapsulant having one or more planar surfaces, a wavelength conversion material layer covering said solid state light source and the top surface of said submount; wherein said submount has a footprint area of less than 12 mm square per 1 mm square light source area, wherein said encapsulant is cube shaped. - View Dependent Claims (62, 63, 64, 65, 66, 67, 68)
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69. An emitter package, comprising:
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one or more solid state light sources on a submount; and an encapsulant on said submount, said encapsulant having one or more planar surfaces, a wavelength conversion material layer covering said one or more solid state light sources and the top surface of said submount; wherein the ratio of the footprint of said submount to the footprint of said one or more solid state light sources is in the range of just over 1 to approximately 20. - View Dependent Claims (70, 71, 72, 73, 74, 75)
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76. An emitter package, comprising:
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one or more solid state light sources on a submount; and a transparent encapsulant on said submount, said encapsulant having one or more planar surfaces, a wavelength conversion material layer covering said solid state light source and the top surface of said submount; wherein said submount has a footprint ratio of approximately 1 by 1, with a corresponding height ratio in the range of approximately 0.5 to 5. - View Dependent Claims (77, 78, 79, 80, 81, 82, 83, 84, 85, 86)
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87. A solid state luminaire, comprising:
a solid state light source with one or more light emitting diode (LED) packages, comprising; an LED light source on a submount; a blanket conversion material layer on said submount; an encapsulant over said conversion material layer, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source. - View Dependent Claims (88, 89, 90, 91)
Specification