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Method for inhibiting oxygen and moisture degradation of a device and the resulting device

  • US 9,050,622 B2
  • Filed: 03/24/2014
  • Issued: 06/09/2015
  • Est. Priority Date: 08/18/2005
  • Status: Expired due to Fees
First Claim
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1. A method for sealing a device comprising the steps of:

  • depositing a starting low liquidus temperature inorganic material over at least a portion of said device; and

    heat treating said deposited low liquidus temperature inorganic material that is deposited over said at least a portion of said device in an oxygen and water free environment,wherein said heat treating step is performed in a vacuum or an inert environment and at a temperature which does not damage components in said device.

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