Microelectromechanical system device with electrical interconnections and method for fabricating the same

• US 9,051,170 B2
• Filed: 04/30/2012
• Issued: 06/09/2015
• Est. Priority Date: 12/29/2011
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Huang, Chao-Ta, Hsu, Yu-Wen, Kuo, Chin-Fu
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/459,271
• Publication Number:
  US 20130167632A1
• Time in Patent Office: 1,135 Days
• Field of Search: 735/143.1, 735/143.4, 735/143.3, 735/143.2, 735/041.2, 735/040.4, 735/141.6, 257/417, 257/419, 257/421, 257/423, 257/427, 438/406, 438/411
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 2203/0154 Torsion bars
• CPC Class Codes: B81B 2203/058 Rotation out of a plane parallel to the substrate
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: G01R 33/0286 comprising microelectromechanical systems [MEMS] MEMS devices in general B81B

Abstract

A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.

Claims

1. A microelectromechanical system device with electrical interconnections comprising:

a mass including;

an insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer;

a trench of mass disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other;

a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion; and

a substrate including;

at least one electrode disposed on an upper surface of the substrate;

wherein, in a working status, an electrical current flows through the base conductive layer, the conductive through hole of mass and the first conductive portion and an electrical potential difference exists between the second conductive portion and the electrode.

2. The microelectromechanical system device with electrical interconnections according to claim 1, further comprising:

a first anchor including;

a first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor; and

a first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first insulation layer and dividing the lower conductive layer of the first anchor into an inner conductive portion of the first anchor and an outer conductive portion of the first anchor which are insulated electrically from each other;

wherein, the inner conductive portion of the first anchor is electrically coupled to the second conductive portion; and

a second anchor including;

a second insulation layer dividing the second anchor into an upper conductive layer of the second anchor and a lower conductive layer of the second anchor.

3. The microelectromechanical system device with electrical interconnections according to claim 1, wherein the microelectromechanical system device with electrical interconnections is adapted to sense magnetic force.

4. The microelectromechanical system device with electrical interconnections according to claim 2, further comprising at least one first conductive through hole disposed in the first anchor, the at least one first conductive through hole passing through the first insulation layer and connecting the upper conductive layer of the first anchor and the outer conductive portion of the first anchor.

5. The microelectromechanical system device with electrical interconnections according to claim 2, further comprising at least one spring including:

a third insulation layer dividing the at least one spring into an upper conductive layer of the spring and a lower conductive layer of the spring, wherein the lower conductive layer of the spring connects the inner conductive portion of the first anchor and the second conductive portion of the mass, and the upper conductive layer of the spring connects the upper conductive layer of the first anchor and the base conductive layer.

6. The microelectromechanical system device with electrical interconnections according to claim 1, wherein a portion of the insulation layer of mass is covered by the base conductive layer, and the base conductive layer is a spiral-shaped conductor with at least one turn.

7. The microelectromechanical system device with electrical interconnections according to claim 1, wherein the trench of mass is an open-loop-shaped electrical insulation trench.

8. The microelectromechanical system device with electrical interconnections according to claim 2, further comprising an electrical insulation material filled in the first trench and the trench of mass.

9. The microelectromechanical system device with electrical interconnections according to claim 2, further comprising two pennanent magnets and a second anchor, wherein the first anchor and the second anchor are located on two opposite sides of the mass, and the two permanent magnets are located near the mass and are aligned with a line that is perpendicular to the line connecting the first anchor and the second anchor.

10. The microelectromechanical system device with electrical interconnections according to claim 1, wherein the mass is a frame.

11. The microelectromechanical system device with electrical interconnections according to claim 10, further comprising:

an inner frame disposed in the frame and connected to the frame via a plurality of first springs; and

an inner mass disposed in the inner frame and connected to the inner frame via a plurality of second springs;

wherein, the inner mass is electrically coupled to the target conductive layer of the frame through the second springs, the inner frame and the first springs.

12. The microelectromechanical system device with electrical interconnections according to claim 1, wherein an electrical resistance of the base conductive layer is greater than an electrical resistance of the target conductive layer.

13. A microelectromechanical system device with electrical interconnections, being adapted to sense magnetic force, comprising:

a first anchor including;

a first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor;

a first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first insulation layer and dividing the lower conductive layer of the first anchor into an inner conductive portion of the first anchor and an outer conductive portion of the first anchor which are insulated electrically from each other;

a first conductive through hole disposed in the first anchor, the first conductive through hole passing through the first insulation layer and connecting the upper conductive layer of the first anchor and the outer conductive portion of the first anchor;

a second anchor including;

a second insulation layer dividing the second anchor into an upper conductive layer of the second anchor and a lower conductive layer of the second anchor;

a second trench disposed in the lower conductive layer of the second anchor, the second trench passing through the lower conductive layer of the second anchor to the second insulation layer and dividing the lower conductive layer of the second anchor into an inner conductive portion of the second anchor and an outer conductive portion of the second anchor which are insulated electrically from each other;

a mass including;

an insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer;

a trench of mass, being an open-loop-shaped electrical insulation trench, disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other; and

a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion;

two torsion springs, each of the torsion springs including;

a third insulation layer dividing each of the torsion springs into an upper conductive layer of the torsion spring and a lower conductive layer of the torsion spring;

wherein,

the base conductive layer is a spiral-shaped conductor with at least one turn;

the upper conductive layer of one of the torsion springs connects the upper conductive layer of the first anchor and the base conductive layer, and the lower conductive layer of the one of the torsion springs connects the inner conductive portion of the first anchor and the second conductive portion of the mass;

the lower conductive layer of the other torsion spring connects the inner conductive portion of the second anchor and the first conductive portion of the mass.

14. The microelectromechanical system device with electrical interconnections according to claim 13, further comprising a substrate with at least one electrode thereon, wherein in a working status, an electrical potential difference exists between the at least one electrode and the second conductive portion of the mass.

15. The microelectromechanical system device with electrical interconnections according to claim 13, wherein an electrical current, in a working status, flows through the outer conductive portion of the first anchor, the first conductive through hole, the upper conductive layer of the first anchor, the upper conductive layer of the one of the torsion springs, the base conductive layer, the conductive through hole of mass, the first conductive portion, the lower conductive layer of the other one of the torsion springs and the inner conductive portion of the second anchor sequentially.

16. The microelectromechanical system device with electrical interconnections according to claim 13, wherein the mass is a frame.

17. A method for fabricating a microelectromechanical system device with electrical interconnections, the method comprising:

providing a substrate including at least one electrode disposed on an upper surface of the substrate;

forming a mass, wherein the mass comprises

an insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer;

a trench of mass disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other;

forming a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion,

wherein, in a working status, an electrical current can flow through the base conductive layer, the conductive through hole of mass and the first conductive portion and an electrical potential difference exists between the second conductive portion and the electrode of the substrate.

18. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 17, the method further comprising:

forming a first anchor on the substrate, wherein the first anchor including;

a first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor; and

a first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first insulation layer and dividing the lower conductive layer of the first anchor into an inner conductive portion of the first anchor and an outer conductive portion of the first anchor which are insulated electrically from each other,

wherein the inner conductive portion of the first anchor is electrically coupled to the second conductive portion; and

forming a second anchor on the substrate, wherein the second anchor including;

a second insulation layer dividing the second anchor into an upper conductive layer of the second anchor and a lower conductive layer of the second anchor.

19. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 18, the method further comprising:

forming at least one spring, wherein the at least one spring including;

a third insulation layer dividing the at least one spring into an upper conductive layer of the spring and a lower conductive layer of the spring, wherein the lower conductive layer of the spring connects the inner conductive portion of the first anchor and the second conductive portion of the mass, and the upper conductive layer of the spring connects the upper conductive layer of the first anchor and the base conductive layer.

20. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 17, wherein a portion of the insulation layer of mass is covered by the base conductive layer, and the base conductive layer is a spiral-shaped conductor with at least one turn.

21. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 17, wherein the trench of mass is an open-loop-shaped electrical insulation trench.

22. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 18, wherein the method further comprising forming an electrical insulation material filled in the first trench and the trench of mass.

23. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 18, wherein the first anchor and the second anchor are located on two opposite sides of the mass, and two permanent magnets are located near the mass and are aligned with a line that is perpendicular to the line connecting the first anchor and the second anchor.

24. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 17, wherein the mass formed is a frame, and the method further comprising:

forming an inner frame disposed in the frame and connected to the frame via a plurality of first springs; and

forming an inner mass disposed in the inner frame and connected to the inner frame via a plurality of second springs,

wherein, the inner mass is electrically coupled to the target conductive layer of the frame through the second springs, the inner frame and the first springs.

25. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 17, wherein an electrical resistance of the base conductive layer is greater than an electrical resistance of the target conductive layer.

26. A method for fabricating a microelectromechanical system device with electrical interconnections, the method comprising:

forming a first anchor, wherein the first anchor including;

an first insulation layer dividing the first anchor into an upper conductive layer of the first anchor and a lower conductive layer of the first anchor;

an first trench disposed in the lower conductive layer of the first anchor, the first trench passing through the lower conductive layer of the first anchor to the first insulation layer and dividing the lower conductive layer of the first anchor into an inner conductive portion of the first anchor and an outer conductive portion of the first anchor which are insulated electrically from each other;

a first conductive through hole disposed in the first anchor, the first conductive through hole passing through the first insulation layer and connecting the upper conductive layer of the first anchor and the outer conductive portion of the first anchor;

forming a second anchor, wherein the second anchor including;

a second insulation layer dividing the second anchor into an upper conductive layer of the second anchor and a lower conductive layer of the second anchor;

an second trench disposed in the lower conductive layer of the second anchor, the second trench passing through the lower conductive layer of the second anchor to the second insulation layer and dividing the lower conductive layer of the second anchor into an inner conductive portion of the second anchor and an outer conductive portion of the second anchor which are insulated electrically from each other;

forming a mass, wherein the mass including;

an insulation layer of mass dividing the mass into a base conductive layer and a target conductive layer;

a trench of mass, being an open-loop-shaped electrical insulation trench, disposed in the target conductive layer, the trench of mass passing through the target conductive layer to the insulation layer of mass and dividing the target conductive layer into a first conductive portion and a second conductive portion which are insulated electrically from each other; and

forming a conductive through hole of mass passing through the insulation layer of mass and connecting the base conductive layer and the first conductive portion;

forming two torsion springs, wherein each of the torsion springs including;

a third insulation layer dividing each of the torsion springs into an upper conductive layer of the torsion spring and a lower conductive layer of the torsion spring;

wherein,

the base conductive layer is a spiral-shaped conductor with at least one turn;

the upper conductive layer of one of the torsion springs connects the upper conductive layer of the first anchor and the base conductive layer, and the lower conductive layer of the one of the torsion springs connects the inner conductive portion of the first anchor and the second conductive portion of the mass;

the lower conductive layer of the other torsion spring connects the inner conductive portion of the second anchor and the first conductive portion of the mass.

27. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 26, the method further comprising

forming a substrate with at least one electrode thereon, wherein in a working status, an electrical potential difference can exist between the at least one electrode and the second conductive portion of the mass.

28. The method for fabricating a microelectromechanical system device with electrical interconnections according to claim 26, wherein an electrical current, in a working status, can flow through the outer conductive portion of the first anchor, the first conductive through hole, the upper conductive layer of the first anchor, the upper conductive layer of the one of the torsion springs, the base conductive layer, the conductive through hole of mass, the first conductive portion, the lower conductive layer of the other one of the torsion springs and the inner conductive portion of the second anchor sequentially.