Heat-reduction methods and systems related to microfluidic devices
First Claim
1. A method for generating heat in selected regions of a microfluidic complex, the method comprising:
- providing a microfluidic complex comprising at least one thermally actuated component;
providing a thermally insulating substrate comprising a heating element configured to actuate the at least one thermally actuated component; and
supplying electrical current from a current source to the heating element through at least one conductive lead, the at least one conductive lead having a lower current density than the heating element.
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Abstract
Systems and methods for preventing or reducing unwanted heat in a microfluidic device while generating heat in selected regions of the device are described. Current can be supplied to a heating element through electric leads that are designed so that the current density in the leads is substantially lower than the current density in the heating element. Unwanted heat in the microfluidic complex can be reduced by thermally isolating the electric leads from the microfluidic complex by, for example, running each lead directly away from the microfluidic complex. Unwanted heat can be removed from selected regions of the microfluidic complex using one or more cooling devices.
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Citations
20 Claims
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1. A method for generating heat in selected regions of a microfluidic complex, the method comprising:
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providing a microfluidic complex comprising at least one thermally actuated component; providing a thermally insulating substrate comprising a heating element configured to actuate the at least one thermally actuated component; and supplying electrical current from a current source to the heating element through at least one conductive lead, the at least one conductive lead having a lower current density than the heating element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for reducing transfer of heat generated by a heating element in a microfluidic processing system, the method comprising:
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providing a substrate having at least one heating element; providing a microfluidic complex comprising a first heating surface proximate to at least one thermally actuated component of the microfluidic complex; placing the first heating surface of the microfluidic complex in thermal communication with the at least one heating element of the substrate; and supplying electrical current to the at least one heating element through a conductive lead having a greater cross-sectional area in at least one dimension than the at least one heating element. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of manufacturing a microfluidic processing system, the method comprising:
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providing a substrate comprising a plurality of heating elements, each heating element configured to apply heat to a thermally actuated component;
providing a microfluidic complex comprising a first heating surface proximate to the at least one thermally actuated component of the microfluidic complex; androuting at least one conductive lead to each of the plurality of heating elements, at least one conductive lead having a greater cross-sectional area in at least one dimension than the heating element to which it is routed. - View Dependent Claims (20)
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Specification