Systems, methods, and devices for sealing LED light sources in a light module

• US 9,052,070 B2
• Filed: 09/30/2013
• Issued: 06/09/2015
• Est. Priority Date: 11/25/2009
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Inventors: Davis, Matthew A., Bradford, Reed Alan, Patrick, Ellis W.
• Primary Examiner(s): BRUCE, DAVID VERNON
• Application Number:
  US14/041,285
• Publication Number:
  US 20140126205A1
• Time in Patent Office: 617 Days
• Field of Search: 362/218, 362/217.02, 362/237, 362/244, 362/249.02
• US Class Current: 1/1
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 65/48 using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 65/483 Reactive adhesives, e.g. chemically curing adhesives
• CPC Class Codes: B29C 66/45 Joining of substantially the whole surface of the articles methods or apparatus for laminating B32B37/00
• CPC Class Codes: B29C 66/474 said single elements being substantially non-flat
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 31/03 with provision for venting for vehicle head lights F21S45/33; for vehicle rear lights F21S41/192
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/16 square or rectangular, e.g. for light panels
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A light module includes one or more LEDs coupled to a circuit board, a lens disposed over at least one LED, and an adhesive layer disposed between each LED and the lens. A flange extends from at least one side of the lens. The adhesive layer fixes the lens in an optical alignment over the corresponding LED. The adhesive layer includes at least one of a non-permeable layer with an adhesive material on the top and bottom surfaces, a gas-permeable layer with an adhesive material on the top and bottom surfaces, a deposited material, and an over mold material. An alignment tool including one or more optical recesses and one or more alignment features is used in the assembly of at least one of an optical assembly and a light module that includes the optical assembly. The alignment tool facilitates precise alignment of the lenses over the LEDs.

Claims

1. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs; and

an adhesive layer between the circuit board and the lens, wherein the adhesive layer fixes the lens in an optical alignment over the corresponding LED, and wherein the adhesive layer comprises a gas-permeable layer.

2. The light module of claim 1, wherein the adhesive layer comprises a material layer, the material layer allowing air to flow horizontally and vertically therethrough and enabling gas exchange between an area adjacent the at least one lens and a second area.

3. The light module of claim 2, wherein the material layer enables gas exchange between the area adjacent the at least one lens and an environment external to the light module.

4. The light module of claim 1, wherein the adhesive layer comprises a carrier layer having one or more breathing apertures formed therein, the breathing apertures facilitating gas exchange between an area adjacent the at least one lens and an environment external to the light module.

5. The light module of claim 1, wherein the plurality of LEDs comprise an array of LED die packages.

6. The light module of claim 1, wherein the adhesive layer comprises a fluid deposition.

7. A light module, comprising:

a plurality of light emitting diodes (LEDs) coupled to a circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs; and

a tape layer disposed between the circuit board and each lens, wherein the tape layer further comprises a top side and a bottom side, the bottom side comprising a first adhesive material and the top side comprising a second adhesive material, and wherein the first adhesive adheres the tape layer to the circuit board.

8. The light module of claim 7, wherein the tape layer comprises a first portion and a second portion, wherein the first portion is more gas-permeable than the second portion.

9. The light module of claim 8, wherein the second portion extends longitudinally along a generally central portion of the light module and wherein the first portion is disposed along each longitudinal side of the second portion and along each longitudinal edge of the light module.

10. The light module of claim 8, wherein the second portion comprises glass fiber tape.

11. The light module of claim 7, further comprising a gap filler disposed adjacent at least a portion of the flange extending from at least one side of the lens and adhered to the second adhesive material on the top side of the tape layer.

12. The light module of claim 11, wherein the gap filler is gas-permeable.

13. The light module of claim 7, wherein at least one of the first adhesive material and the second adhesive material comprises at least one of a silicone adhesive material and an acrylic adhesive material.

14. A light module, comprising:

a circuit board comprising a top surface;

a plurality of light emitting diodes (LEDs) coupled to the circuit board;

at least one lens, each lens disposed over at least one LED of the plurality of LEDs, wherein the lens comprises a lens cavity;

one or more air channels formed in or on top of the top surface of the circuit board, at least one of the air channels providing fluid communication between at least one lens cavity and another area of the light module.

15. The light module of claim 14, wherein the at least one air channel is etched into the circuit board.

16. The light module of claim 14, further comprising a conformal coating applied to a portion of the top surface of the circuit board, wherein the application of the coating to only a portion of the circuit board creates the least one of the air channel on the top surface of the circuit board.

17. The light module of claim 14, further comprising an adhesive layer disposed between the circuit board and each lens, wherein the at least one air channel is formed in the adhesive layer and extends from at least one lens cavity to an edge of the adhesive layer.

18. The light module of claim 14, wherein the at least one air channel extends from the at least one lens cavity to an edge of the light module and provides fluid communication between the at least one lens cavity and an environment external to the light module.

19. The light module of claim 14, wherein the at least one air channel extends from a first lens cavity to a second lens cavity, providing fluid communication between the first lens cavity and the second lens cavity.

20. The light module of claim 14, further comprising a material layer disposed on top of the top surface of the circuit board, the material layer comprising one or more breathing ports, wherein the breathing ports provide fluid communication between the at least one air channel and an environment external to the light module.