Sealed pixel assemblies, kits and methods
First Claim
Patent Images
1. A sealed module comprising:
- a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board;
a potting shell coupled to the circuit board, the potting shell including at least one cavity, the potting shell at least partially enclosing the one or more light-emitting elements; and
an encapsulating material disposed within the cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior.
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Abstract
Discrete flexible pixel assemblies can be hermetically sealed from the environment and can comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel assemblies can include encapsulation means, exterior encasement means, and cable connector means.
130 Citations
20 Claims
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1. A sealed module comprising:
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a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board; a potting shell coupled to the circuit board, the potting shell including at least one cavity, the potting shell at least partially enclosing the one or more light-emitting elements; and an encapsulating material disposed within the cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method, comprising:
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providing or receiving a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board; coupling a potting shell to a perimeter of the circuit board so that the potting shell at least partially encloses the one or more light-emitting elements, the potting shell forming at least one cavity; disposing an encapsulating material within the at least one cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A method comprising:
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providing or receiving a plurality of sealed modules, wherein each sealed module includes; a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board, a potting shell coupled to the circuit board, the potting shell including at least one cavity, the potting shell at least partially enclosing the one or more light-emitting elements, and an encapsulating material disposed within the cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior; and coupling the plurality of sealed modules to a mounting surface to form an electronic display.
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Specification