Integrated circuit and manufacturing method

• US 9,052,267 B2
• Filed: 10/14/2014
• Issued: 06/09/2015
• Est. Priority Date: 01/31/2012
• Status: Active Grant

• Current Assignee: ams AG (Ams-Osram AG)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Ponomarev, Youri Victorovitch, Tio Castro, David, Daamen, Roel
• Primary Examiner(s): McCall Shepard, Sonya D
• Application Number:
  US14/513,352
• Publication Number:
  US 20150031158A1
• Time in Patent Office: 238 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G01N 27/048 for determining moisture content of the material
• CPC Class Codes: G01N 27/121 for determining moisture content, e.g. humidity, of the fluid moisture content of the tested material G01N27/048
• CPC Class Codes: G01N 27/223 for determining moisture content, e.g. humidity rain detectors on vehicle windows B60S1/0825
• CPC Class Codes: G01N 33/0036 Specially adapted to detect a particular component all the other sub-groups of G01N33/0004 take precedence
• CPC Class Codes: H01L 27/144 Devices controlled by radiation
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H10K 30/00 Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation integrated devices or assemblies of multiple devices H10K39/00, H10K65/00; electrolytic light-sensitive devices H01G9/20
• CPC Class Codes: H10K 85/10 Organic polymers or oligomers
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Disclosed is an integrated circuit comprising a substrate (10) including at least one light sensor (12); an interconnect structure (20) over the substrate; at least one passivation layer (30) over the interconnect structure, said passivation layer including a first area over the at least one light sensor; and a gas sensor such as a moisture sensor (50) at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer (46′) in between a first electrode (42) and a second electrode (44), the gas sensitive layer further comprising a portion (46″) over the first area. A method of manufacturing such an IC is also disclosed.

Claims

1. A method of manufacturing an integrated circuit comprising at least one light sensor and a gas sensor, the method comprising:

providing a substrate including at least one light sensor;

forming an interconnect structure over the substrate, wherein the interconnect structure is configured to be at least partially transparent to light such that light from outside the integrated circuit can reach the at least one light sensor;

forming at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor;

forming a gas sensor at least partially on the at least one passivation layer by;

forming a pair of electrodes on a further area of the at least one passivation layer;

depositing a gas sensitive layer over the at least one passivation layer including the pair of electrodes; and

patterning the gas sensitive layer such that the gas sensitive layer remains in the first and further areas.

2. The method of claim 1, further comprising including a dye in the gas sensitive layer.

3. The method of claim 1, wherein the gas sensitive layer is a polymer layer is selected from the group consisting of polyacrylates, polymethacrylates, polyimides, polyamides, polyamines, polypyridines, polycarbonates, polyacetates polystyrenes, polyacetylenes, polyanilines, polypyrroles, polythiophenes, poly(phenyl vinylene) and derivatives thereof;

and

the method further comprising, depositing a moisture sensitive layer by spin-coating.