Laser-ablating mechanical and security features for security documents

• US 9,053,404 B2
• Filed: 07/03/2013
• Issued: 06/09/2015
• Est. Priority Date: 11/09/2009
• Status: Expired due to Fees

• Current Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David
• Primary Examiner(s): Lam, Cathy
• Application Number:
  US13/934,456
• Publication Number:
  US 20130299589A1
• Time in Patent Office: 706 Days
• Field of Search: 257/676, 257/679, 257/684, 257/687, 257/669, 257/667, 257/668, 534/52, 534/56
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Channels may be formed in the inlay substrate of a transponder, such as by laser ablation, and the antenna wire may subsequently be laid in the channels. Laying the wire in a channel ensures that it substantially fully embedded in the substrate, thereby eliminating a need for pressing the wire into the substrate. The channels may be tapered, or profiled, to enhance adhesion of a self-bonding wire. A recess for the chip module can also be formed using laser ablation, and insulation may be removed from end portions of the antenna wire using laser ablation. Laser ablation may also be used to create various mechanical and security features.

Claims

1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first surface thereof for receiving a chip module therein, and for receiving an antenna wire disposed in the inlay substrate and connected with the chip module, the inlay substrate comprising at least one of the following features incorporated into the inlay substrate:

trenches disposed in the inlay substrate, near the recess, for de-stressing the inlay substrate layer during hot lamination;

perforations disposed in the inlay substrate, around the recess, for making a recess area of the substrate frangible;

notches disposed in the inlay substrate, in side edges of the recess, and pins inserted into the notches for resiliently holding the chip module in place; and

slots disposed in the inlay substrate, around at least one side edge of the recess for resiliently holding the chip module in place.

2. The substrate of claim 1, wherein the trenches, perforations, notches and/or slots are formed by laser ablation.

3. The inlay substrate of claim 1, wherein:

the features are trenches formed in the inlay substrate; and

the trenches are formed within a few millimeters of the recess.

4. The inlay substrate of claim 1, wherein:

the features are trenches formed in the inlay substrate; and

the trenches are approximately 0.5 mm wide and approximately 2 mm long.

5. The inlay substrate of claim 1, wherein:

the features are trenches formed in the inlay substrate; and

at least some of the trenches extend to the recess.

6. The inlay substrate of claim 1, wherein:

the features are trenches formed in the inlay substrate; and

the trenches extend at least partially through the inlay substrate.

7. The inlay substrate of claim 1, wherein:

the features are trenches formed in the inlay substrate; and

the trenches provide at least one of (i) de-stressing the inlay substrate layer during hot lamination of a cover layer to the inlay substrate, (ii) allowing for flexure of the inlay substrate without buckling.

8. The inlay substrate of claim 1, wherein:

the features are perforations disposed in the inlay substrate; and

the perforations at least partially encircle the recess.

9. The inlay substrate of claim 1, wherein:

the features are perforations disposed in the inlay substrate; and

the perforations extend fully through the inlay substrate.

10. The inlay substrate of claim 1, wherein:

the features are perforations disposed in the inlay substrate; and

selected ones of the perforations overlap or intersect other ones of the perforations.

11. An electronic passport cover comprising:

a cover layer; and

the inlay substrate of claim 1, wherein;

the features are perforations disposed in the inlay substrate; and

peeling the cover layer from the inlay substrate results in at least partial destruction at least one of the substrate and wire interconnections to the chip module.

12. The inlay substrate of claim 1, wherein:

the features are notches in the inlay substrate and pins inserted into the notches; and

the notches extend from one or more side edges of the recess to external the recess.

13. The inlay substrate of claim 1, wherein:

the features are notches in the inlay substrate and pins inserted into the notches; and

the notches have a cross-dimension of approximately 1 mm.

14. The inlay substrate of claim 1, wherein:

the features are notches in the inlay substrate and pins inserted into the notches; and

the notches extend at least partially through the inlay substrate.

15. The inlay substrate of claim 1, wherein:

the features are notches in the inlay substrate and pins inserted into the notches; and

the pins have a cross-dimension slightly greater than a cross-dimension of the notches, so that when a pin is inserted into a notch, the inlay substrate material between the notch and the recess deflects towards the chip module, holding the chip module in place.

16. The inlay substrate of claim 1, wherein:

the features are slots in the inlay substrate; and

the slots are rectangular, measuring approximately 5-8 mm×

approximately 1 mm.

17. The inlay substrate of claim 1, wherein:

the features are slots in the inlay substrate; and

the slots extend at least partially through the inlay substrate.