Detecting defects on a wafer
First Claim
1. A computer-implemented method for detecting defects on a wafer, comprising:
- acquiring first raw output for a wafer generated using a first optics mode of an inspection system and second raw output generated for the wafer using a second optics mode of the inspection system;
identifying one or more characteristics of the first raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer;
assigning individual output in the second raw output to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas;
separately assigning one or more defect detection parameters to the different segments; and
applying the assigned one or more defect detection parameters to the individual output in the second raw output assigned to the different segments to thereby detect defects on the wafer.
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Abstract
Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.
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Citations
51 Claims
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1. A computer-implemented method for detecting defects on a wafer, comprising:
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acquiring first raw output for a wafer generated using a first optics mode of an inspection system and second raw output generated for the wafer using a second optics mode of the inspection system; identifying one or more characteristics of the first raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer; assigning individual output in the second raw output to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas; separately assigning one or more defect detection parameters to the different segments; and applying the assigned one or more defect detection parameters to the individual output in the second raw output assigned to the different segments to thereby detect defects on the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a method for detecting defects on a wafer, wherein the method comprises:
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acquiring first raw output for a wafer generated using a first optics mode of an inspection system and second raw output generated for the wafer using a second optics mode of the inspection system; identifying one or more characteristics of the first raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer; assigning individual output in the second raw output to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array area; separately assigning one or more defect detection parameters to the different segments; and applying the assigned one or more defect detection parameters to the individual output in the second raw output assigned to the different segments to thereby detect defects on the wafer.
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27. A system configured to detect defects on a wafer, comprising:
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an inspection subsystem configured to generate first raw output for a wafer by scanning the wafer using a first optics mode of the inspection subsystem and to generate second raw output for the wafer by scanning the wafer using a second optics mode of the inspection subsystem; and a computer subsystem configured to; acquire the first and second raw output; identify one or more characteristics of the first raw output that correspond to one or more geometrical characteristics of patterned features formed on the wafer; assign individual output in the second raw output to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different, wherein the one or more geometrical characteristics that correspond to one of the different segments comprise one or more geometrical characteristics of page breaks, and wherein the one or more geometrical characteristics that correspond to another of the different segments comprise one or more geometrical characteristics of array areas; separately assign one or more defect detection parameters to the different segments; and apply the assigned one or more defect detection parameters to the individual output in the second raw output assigned to the different segments to thereby detect defects on the wafer. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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Specification