MEMS structures and methods for forming the same
First Claim
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1. A method comprising:
- forming a micro-electro-mechanical system (MEMS) device;
forming a first bond layer adjacent the MEMS device; and
forming a protection layer over the first bond layer, wherein the steps of forming the first bond layer and the protection layer comprise in-situ deposition of the first bond layer and the protection layer; and
after the forming the protection layer, forming an anti-stiction coating comprising a first portion on a movable element of the MEMS device.
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Abstract
A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.
8 Citations
20 Claims
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1. A method comprising:
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forming a micro-electro-mechanical system (MEMS) device; forming a first bond layer adjacent the MEMS device; and forming a protection layer over the first bond layer, wherein the steps of forming the first bond layer and the protection layer comprise in-situ deposition of the first bond layer and the protection layer; and after the forming the protection layer, forming an anti-stiction coating comprising a first portion on a movable element of the MEMS device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a micro-electro-mechanical system (MEMS) device over a substrate, wherein the step of forming the MEMS device comprises; forming a movable element as a first capacitor plate of a capacitor; and forming a fixed element as a second capacitor plate of the capacitor; depositing a metal layer over the substrate in a process chamber; depositing a protection layer over the metal layer and in the process chamber, wherein between the step of depositing the metal layer and the step of depositing the protection layer, no vacuum break occurs to the process chamber; patterning the metal layer and the protection layer to form a bond ring encircling the MEMS device; and bonding a cap to cover the MEMS device, wherein during the step of bonding, the protection layer forms a eutectic alloy with the bond ring in a eutectic reaction. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
bonding a cap to a bond ring through eutectic bonding, wherein the bond ring is covered by a protection ring, and wherein a micro-electro-mechanical system (MEMS) device is formed underlying the bond ring, and the MEMS device comprises; a movable element as a first capacitor plate of a capacitor; and a fixed element as a second capacitor plate of the capacitor. - View Dependent Claims (16, 17, 18, 19, 20)
Specification