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MEMS structures and methods for forming the same

  • US 9,054,121 B2
  • Filed: 10/24/2011
  • Issued: 06/09/2015
  • Est. Priority Date: 10/24/2011
  • Status: Active Grant
First Claim
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1. A method comprising:

  • forming a micro-electro-mechanical system (MEMS) device;

    forming a first bond layer adjacent the MEMS device; and

    forming a protection layer over the first bond layer, wherein the steps of forming the first bond layer and the protection layer comprise in-situ deposition of the first bond layer and the protection layer; and

    after the forming the protection layer, forming an anti-stiction coating comprising a first portion on a movable element of the MEMS device.

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