Thermal interface members for removable electronic devices
First Claim
1. An apparatus, comprising:
- a thermal interface member configured to be coupled to a first surface of a printed circuit board such that a portion of the thermal interface member is in contact with a thermally-conductive portion of the first surface when the thermal interface member is coupled to the first surface, the portion of the thermal interface member being deformable and thermally-conductive, the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board when the thermal interface member is coupled to the first surface, the second layer including a first region and a second region mutually-exclusive from the first region, the first region including a first material that is deformable and thermally-conductive, the second region including a second material that is an adhesive.
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Accused Products
Abstract
In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.
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Citations
17 Claims
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1. An apparatus, comprising:
a thermal interface member configured to be coupled to a first surface of a printed circuit board such that a portion of the thermal interface member is in contact with a thermally-conductive portion of the first surface when the thermal interface member is coupled to the first surface, the portion of the thermal interface member being deformable and thermally-conductive, the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board when the thermal interface member is coupled to the first surface, the second layer including a first region and a second region mutually-exclusive from the first region, the first region including a first material that is deformable and thermally-conductive, the second region including a second material that is an adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus, comprising:
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a printed circuit board configured to be coupled to an electronic device, a first surface of the printed circuit board including a thermally-conductive portion that is thermally coupled to a second surface of the printed circuit board; a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface, the portion of the thermal interface member having a first layer and a second layer, the first layer being tear-resistant and thermally-conductive, the second layer disposed between the first layer and the first surface of the printed circuit board, the second layer including at least one of a thermally-conductive gel, a thermally-conductive grease or a phase-change material having a phase-change temperature threshold of greater than approximately 40 degrees Celsius; and a frame coupled to the first surface of the printed circuit board, the frame defining, at least in part, an internal volume within which at least a portion of the electronic device can be disposed when the electronic device is coupled to the printed circuit board, the frame defining an opening within which the portion of the thermal interface member is disposed such that the portion of the thermal interface member is in slidable contact with the electronic device. - View Dependent Claims (9, 10, 11, 12, 13)
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14. An apparatus, comprising:
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a printed circuit board configured to be coupled to an electronic device, a first surface of the printed circuit board including a thermally-conductive portion that is thermally coupled to a second surface of the printed circuit board; and a thermal interface member coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface, the portion of the thermal interface member being deformable and thermally-conductive, the thermal interface member having a first layer and a second layer, the first layer being tear-resistant, the second layer disposed between the first layer and the first surface of the printed circuit board, the second layer including an adhesive and at least one of a thermally-conductive gel, a thermally-conductive grease or a phase-change material having a phase-change temperature threshold of greater than approximately 40 degrees Celsius, the adhesive being separate from the at least one of the thermally-conductive gel, the thermally- conductive grease or the phase-change material. - View Dependent Claims (15, 16, 17)
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Specification