Semiconductor package and manufacturing method thereof

• US 9,056,765 B2
• Filed: 07/09/2013
• Issued: 06/16/2015
• Est. Priority Date: 06/01/2010
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Jung, Jong Dae, Bang, Dong Hyun, Lee, Yung Woo, Cho, EunNaRa, Kim, Byung Jun
• Primary Examiner(s): Garber, Charles
• Assistant Examiner(s): MUSTAPHA, ABDULFATTAH B
• Application Number:
  US13/937,764
• Publication Number:
  US 20140017843A1
• Time in Patent Office: 707 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H04R 2201/003 : Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 23/00 : Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045

Abstract

Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.

Claims

1. A method for producing a semiconductor package, the manufacturing method comprising:

preparing a mother board having a plurality of N×

M package device arrays, each package device of the package device arrays comprising at least one semiconductor chip and an active element attached to the mother board;

preparing a plurality of N×

M window arrays corresponding to the package device arrays, each window of the window arrays comprising sidewalls forming cavity regions for the package device arrays;

coating an adhesive on adhering regions formed on the window arrays to be adhered to the mother board;

adhering the window arrays to a target position on the mother board using the adhesive; and

fabricating lidded package devices by severing the package device arrays and adhered window arrays by a cutting process.

2. The method of claim 1, wherein said preparing a plurality of N×

M window arrays comprises molding the window arrays from plastic.

3. The method of claim 2, wherein said preparing a plurality of N×

M window arrays comprises forming an EMI shielding layer at least inside respective windows of the window arrays.

4. The method of claim 3, wherein said forming an EMI shielding layer comprises forming the EMI shielding layer by, at least in part, plating a copper/nickel layer.

5. The method of claim 1, wherein the semiconductor chip is a MEMS microphone device.

6. The method of claim 1, wherein the sidewalls and a top plate of each window of the window arrays are at a right angle to each other.

7. The method of claim 1, wherein the adhesive is a solder paste.

8. The method of claim 1, wherein said coating an adhesive comprises screen printing the adhesive on the window arrays.

9. The method of claim 1, wherein N is different from M.

18. The method of claim 1, wherein said coating an adhesive comprises screen printing the adhesive on the window array.

19. The method of claim 1, wherein N is different from M.

10. A method for producing a semiconductor package, the manufacturing method comprising:

preparing a mother board having an N×

M package device array, each package device of the package device array comprising at least one semiconductor chip and an active element attached to the mother board;

providing a molded N×

M window array corresponding to the package device array, each window of the window array comprising sidewalls forming cavity regions for the package device arrays and an electromagnetic interference (EMI) shielding layer inside said each window;

coating an adhesive on adhering regions formed on the window array to be adhered to the mother board;

adhering the window array to a target position on the mother board using the adhesive; and

fabricating lidded package devices by severing the package device array and adhered window array by a cutting process.

11. The method of claim 10, wherein said molding an N×

M window array comprises injection molding the window array from plastic.

12. The method of claim 10, wherein said forming an EMI shielding layer comprises forming the EMI shielding layer by, at least in part, plating a copper/nickel layer.

13. The method of claim 10, wherein the semiconductor chip is a MEMS microphone device.

14. The method of claim 13, wherein the active element is a controller.

15. The method of claim 13, wherein the sidewalls and a top plate of each window of the window arrays are at a right angle to each other.

16. The method of claim 13, wherein the adhesive is a solder paste.

17. The method of claim 13, wherein the adhesive is an epoxy paste.

20. A method for producing a semiconductor package, the manufacturing method comprising:

preparing a mother board having an N×

M package device array, each package device of the package device array having at least one semiconductor chip and an active element attached to the mother board in a respective cavity region;

providing a molded N×

M window array corresponding to the package device array, wherein at least one groove separates adjacent windows of the window array and each window of the window array comprising sidewalls for each of the respective cavity regions;

coating an adhesive on adhering regions formed on the window array to be adhered to the mother board;

adhering the window array to a target position on the mother board using the adhesive; and

fabricating lidded package devices by severing the package device array and adhered window array by a cutting process.