Integrated circuit with electromagnetic energy anomaly detection and processing

• US 9,059,189 B2
• Filed: 03/02/2012
• Issued: 06/16/2015
• Est. Priority Date: 03/02/2011
• Status: Active Grant

• Current Assignee: Nokomis Inc.
• Original Assignee: Nokomis Inc.
• Inventors: Keller, Walter J. III, Pathak, Bogdan A.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US13/410,909
• Publication Number:
  US 20120223403A1
• Time in Patent Office: 1,201 Days
• Field of Search: 340/5.8, 340/572.1, 340/10.1, 726/2, 726/22, 726/34, 702/189
• US Class Current: 1/1
• CPC Class Codes: G06F 21/44 Program or device authentication
• CPC Class Codes: G06F 21/76 in application-specific integrated circuits [ASIC] or field-programmable devices, e.g. field-programmable gate arrays [FPGA] or programmable logic devices [PLD]
• CPC Class Codes: G06F 21/87 by means of encapsulation, e.g. for integrated circuits
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/576 using active circuits
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H04B 1/26 for superheterodyne receivers multiple frequency-changing H03D7/16

Abstract

An integrated circuit includes an antenna, a die manufactured from a semiconducting material, an RF energy collection and processing device disposed on or within the die and including at least a receiver and a processing device, an input configured to supply power to said RF energy collection and processing device and an output for operative communication by said RF energy collection and processing device. The integrated circuit is configurable and operable to provide at least one of electromagnetic emission anomaly detection, tamper detection, anti-tamper monitoring, degradation monitoring, health monitoring, counterfeit detection, software changes monitoring, firmware changes monitoring and monitoring of other RF energy anomalies.

Claims

1. An integrated circuit comprising:

(a) a die manufactured from a semiconducting material;

(b) a radio frequency (RF) energy collection and processing means disposed on or within said die and including at least a receiver receiving an emission of RF energy and a processing means processing a signature of said emission in time and frequency domains, so as to determine one or more anomalous operating characteristics of said integrated circuit attributable to said emission;

(c) an input configured to supply power to said RF energy collection and processing means; and

(d) an output for operative communication by said RF energy collection and processing means.

2. The integrated circuit of claim 1, further including another input configured to program operation of said RF energy collection and processing means.

3. The integrated circuit of claim 1, wherein said die is a first die, wherein said integrated circuit further includes at least one circuit and at least one discrete component disposed on one of said first die and a second die and wherein said RF energy collection and processing means is responsive to the RF energy emitted by at least one of said at least one circuit and said at least one discrete component.

4. The integrated circuit of claim 3, wherein said RF energy collection and processing means detects tampering with said at least one circuit and said at least one discrete component by a focused ion beam technology.

5. The integrated circuit of claim 3, wherein said RF energy collection and processing means detects tampering with said second die by a focused ion beam technology.

6. The integrated circuit of claim 3, wherein said RF energy collection and processing means detects tampering with said second die that is integrated and encapsulated into a physical component package having said first die disposed therewithin.

7. The integrated circuit of claim 3, wherein said RF energy collection and processing means detects at least one of modification of and tampering with software and firmware operating within said integrated circuit.

8. The integrated circuit of claim 3, wherein said RF energy collection and processing means is configured to detect at least one of tampering with and counterfeiting of at least one of said at least one circuit and said at least one discrete component.

9. The integrated circuit of claim 3, wherein said RF energy collection and processing means is configured to detect tampering with said first die.

10. The integrated circuit of claim 1, mounted on a circuit board assembly and wherein said RF energy collection and processing means is responsive to the RF energy emitted by at least one component on said circuit board assembly.

11. The integrated circuit of claim 10, wherein said RF energy collection and processing means is configured to detect at least one of tampering with and counterfeiting of said at least one component on said circuit board assembly.

12. The integrated circuit of claim 10, wherein said RF energy collection and processing means is configured to detect degradation of said at least one component.

13. The integrated circuit of claim 1, mounted within an electrical device including at least one circuit board assembly and wherein said RF energy collection and processing means is configured to detect at least one of tampering with and counterfeiting of said at least one circuit board assembly or an at least one component mounted thereon.

14. The integrated circuit of claim 12, wherein said RF energy collection and processing means monitors said at least one component mounted on said circuit board assembly having said at least one circuit mounted thereon.

15. The integrated circuit of claim 1, further including an antenna in operative coupling with said RF energy collection and processing means.

16. The integrated circuit of claim 15, wherein said antenna is disposed on or within said die.

17. The integrated circuit of claim 15, further including at least one circuit and/or at least one discrete component mounted on said die in a spaced apart relationship with said RF energy collection and processing means and wherein said at least one antenna encases said at least one circuit and/or said at least one discrete component and is coupled to said RF energy collection and processing means.

18. A device comprising:

(a) at least one antenna;

(b) a first die including a first integrated circuit having a radio frequency (RF) energy collection and processing means disposed on or within said first die, said RF energy collection and processing means including a receiver receiving an emission of RF energy, a processing means processing a signature of said emission in time and frequency domains, so as to determine one or more anomalous operating characteristics of said integrated circuit attributable to said emission, and a data storage means;

(c) at least one second die having a second integrated circuit disposed thereon; and

(d) an interface of said first die and said at least one second die with selected connection input and output pins of said first integrated circuit.

19. The device of claim 18, wherein said RF energy collection and processing means continuously monitors RF energy emissions from said at least one second die having said another integrated circuit and monitors changes in characteristics of said RF energy emissions from said at least one second die.

20. The device of claim 18, wherein said RF energy collection and processing means is operable to determine, based on said signature, at least one of a tampering with said device, a performance degradation of said device, changes to a software and/or a firmware operating within said device, a counterfeiting of said device and a failure of said device.

21. The device of claim 20 wherein said device is configured to self-predict Remaining Useful Lifetime (RUL) of at least one of said first die and said at least one second die.

22. The device of claim 20, further including means for destroying operation of said device in an event of tampering with at least one of hardware, firmware and software provided and/or operating within said device.

23. The device of claim 18, wherein said at least one antenna encases said RF energy collection and processing means.

24. An integrated circuit comprising:

(a) a die manufactured from a semiconducting material;

(b) a radio frequency (RF) energy collection and processing means disposed on or within said die and including at least a receiver receiving an emission of RF energy and a processing means processing a signature of said emission;

(c) an input configured to supply power to said RF energy collection and processing means; and

(d) an output for an operative communication by said RF energy collection and processing means, said output is configured to indicate two states of said RF energy collection and processing means, whereby one state is indicative of said emission signature substantially matching a predetermined standard and whereby a second state is indicative of said emission signature deviating from said predetermined standard.

25. An integrated circuit comprising:

(a) a first die manufactured from a semiconducting material;

(b) a radio frequency (RF) energy collection and processing means disposed on or within said first die and including at least a receiver receiving an emission of RF energy and a processing means processing a signature of said emission;

(c) an input configured to supply power to said RF energy collection and processing means;

(d) a second die manufactured from said semiconducting material;

(e) at least one circuit and at least one discrete component disposed on one of said first die and said second die;

(f) wherein said energy collection and processing means is responsive to RF energy emitted by at least one of said at least one circuit and said at least one discrete component; and

(g) wherein said RF energy collection and processing means detects one of tampering with said at least one circuit and said at least one discrete component by a focused ion beam technology, tampering with said second die by a focused ion beam technology, tampering with said second die that is integrated and encapsulated into a physical component package having said first die disposed therewithin, at least one of modification of and tampering with software and firmware operating within said at least one circuit, counterfeiting of at least one of said at least one circuit and said at least one discrete component, and tampering with said first die.

26. A circuit board assembly comprising:

(a) a die manufactured from a semiconducting material;

(b) a radio frequency (RF) energy collection and processing means disposed on or within said die and including at least a receiver receiving an emission of RF energy and a processing means processing a signature of said emission;

(c) an input configured to supply power to said RF energy collection and processing means;

(d) an output for an operative communication by said RF energy collection and processing means; and

(e) wherein said RF energy collection and processing means is responsive to RF energy emitted by at least one component on said circuit board assembly to monitor said at least one component and/or to detect at least one of a tampering with, a counterfeiting of and a degradation of said at least one component on said circuit board assembly.

27. An integrated circuit comprising:

(a) a die manufactured from a semiconducting material;

(b) a radio frequency (RF) energy collection and processing means disposed on or within said die and including at least a receiver receiving an emission of RF energy and a processing means processing a signature of said emission;

(c) an input configured to supply power to said RF energy collection and processing means;

(d) an output for an operative communication by said RF energy collection and processing means; and

(e) wherein said RF energy collection and processing means detects, based on said signature, at least one electromagnetic signature anomaly in at least one of said die, another integrated circuit, an electronic component provided on said and/or within said another integrated circuit, a circuit board including at least one of said die, said another integrated circuit, and said electronic component, an assembly of several circuit boards including at least one of said die, said another integrated circuit, and said electronic component or a fully assembled product including at least one of said die, said another integrated circuit, said electronic component, and said assembly of several circuit boards.

28. The integrated circuit of claim 27, wherein said at least one electromagnetic signature anomaly is a result of at least one of changes to hardware, changes to firmware and changes to software provided and/or operating in said at least one of said die, said another integrated circuit, said electronic component, said assembly of several circuit boards and said fully assembled product.

29. A device comprising:

(a) at least one antenna;

(b) a first die including a first integrated circuit having a radio frequency (RF) energy collection and processing means disposed on or within said first die, said RF energy collection and processing means including a receiver receiving an emission of RF energy, a processing means processing a signature of said emission and a data storage means;

(c) at least one second die having a second integrated circuit disposed thereon;

(d) an interface of said first die and said at least one second die with selected connection input and output pins of said first integrated circuit; and

(e) wherein said (RF) energy collection and processing means is operable, based on said signature, to determine at least one of a tampering with said device, a performance degradation of said device, changes to a software and/or a firmware operating within said device, a counterfeiting of said device and a failure of said device.