Semiconductor device
First Claim
1. A semiconductor device comprising:
- an active region; and
an edge termination structure region that surrounds the active region,wherein the active region includes;
a first-conduction-type drift layer that is a first-conduction-type semiconductor substrate;
a second-conduction-type base layer that is provided in one main surface of the first-conduction-type semiconductor substrate;
a first-conduction-type semiconductor region that is selectively provided in the second-conduction-type base layer;
a plurality of trenches that extend from the one main surface of the first-conduction-type semiconductor substrate to the first-conduction-type drift layer through the first-conduction-type semiconductor region and the second-conduction-type base layer and are arranged with a predetermined first gap therebetween;
a trench gate structure including a gate insulating film that is provided in the trench along an inner wall of the trench and a gate electrode that is provided in the trench with the gate insulating film interposed therebetween;
a metal electrode that contacts the second-conduction-type base layer and the first-conduction-type semiconductor region;
a second-conduction-type extension region that is a portion of the second-conduction-type base layer which extends outward from the outermost trench among the plurality of trenches; and
one or more annular outer trenches that extend from the one main surface of the first-conduction-type semiconductor substrate to the first-conduction-type drift layer through the second-conduction-type extension region and surround all of the trenches, anda second gap between the annular outer trench and the outermost trench or between the adjacent annular outer trenches when the plurality of annular outer trenches are provided is less than the first gap.
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Accused Products
Abstract
Some aspects of the invention include a trench gate structure including a p base layer, an n+ emitter region, a trench, a gate oxide film, and a doped polysilicon gate electrode is provided in an active region. A p-type extension region formed by extending the p base layer to an edge termination structure region can be provided in the circumference of a plurality of trenches. One or more annular outer trenches which are formed at the same time as the plurality of trenches are provided in the p-type extension region. The annular outer trenches can surround all of the trenches. A second gap between the annular outer trench and the outermost trench or between adjacent annular outer trenches is less than a first gap between adjacent trenches.
18 Citations
9 Claims
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1. A semiconductor device comprising:
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an active region; and an edge termination structure region that surrounds the active region, wherein the active region includes; a first-conduction-type drift layer that is a first-conduction-type semiconductor substrate; a second-conduction-type base layer that is provided in one main surface of the first-conduction-type semiconductor substrate; a first-conduction-type semiconductor region that is selectively provided in the second-conduction-type base layer; a plurality of trenches that extend from the one main surface of the first-conduction-type semiconductor substrate to the first-conduction-type drift layer through the first-conduction-type semiconductor region and the second-conduction-type base layer and are arranged with a predetermined first gap therebetween; a trench gate structure including a gate insulating film that is provided in the trench along an inner wall of the trench and a gate electrode that is provided in the trench with the gate insulating film interposed therebetween; a metal electrode that contacts the second-conduction-type base layer and the first-conduction-type semiconductor region; a second-conduction-type extension region that is a portion of the second-conduction-type base layer which extends outward from the outermost trench among the plurality of trenches; and one or more annular outer trenches that extend from the one main surface of the first-conduction-type semiconductor substrate to the first-conduction-type drift layer through the second-conduction-type extension region and surround all of the trenches, and a second gap between the annular outer trench and the outermost trench or between the adjacent annular outer trenches when the plurality of annular outer trenches are provided is less than the first gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification