Printed wiring board and method for manufacturing same

• US 9,060,459 B2
• Filed: 03/30/2012
• Issued: 06/16/2015
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Niki, Ayao, Kitajima, Kazuhisa
• Primary Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US13/434,960
• Publication Number:
  US 20120181072A1
• Time in Patent Office: 1,173 Days
• Field of Search: 174/260, 174/261, 174/262, 174/263, 361/760, 361/767, 361/768, 361/783, 361728-735, 361748-751, 361/790, 361/792, 361/794, 361/808
• US Class Current: 1/1
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/1536 Temporarily stacked PCBs
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49167 with deforming of conductive path

Abstract

A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

Claims

1. A printed wiring board, comprising:

a plurality of conductive layers having a plurality of conductive circuits;

a plurality of resin insulation layers including an uppermost resin insulation layer positioned as an outermost layer of the plurality of resin insulation layers;

a plurality of via conductors formed in the plurality of resin insulation layers, respectively, and connecting the plurality of conductive circuits in the plurality of conductive layers; and

a plurality of component-loading pads each comprising a metal foil and positioned to load an electronic component,

wherein the resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on a roughened surface of the uppermost resin insulation layer and have top surfaces and side surfaces exposed over the roughened surface of the uppermost resin insulation layer such that the top surfaces and side surfaces of the component-loading pads are configured to mount a plurality of solder structures, respectively.

2. The printed wiring board according to claim 1, wherein each of the component-loading pads is truncated such that an area of a bottom surface in contact with the roughened surface of the uppermost resin insulation layer is made larger than an area of a top surface of each of the component-loading pads.

3. The printed wiring board according to claim 2, further comprising the plurality of solder structures formed on the top surfaces of the component-loading pads and on the side surfaces of the component-loading pads, respectively.

4. The printed wiring board according to claim 2, further comprising a plurality of protective films formed on the top surfaces and side surfaces of the component-loading pads, respectively.

5. The printed wiring board according to claim 2, wherein the plurality of via conductors comprises a plurality of a filled via conductors.

6. The printed wiring board according to claim 1, further comprising the plurality of solder structures formed on the top surfaces of the component-loading pads and on the side surfaces of the component-loading pads, respectively.

7. The printed wiring board according to claim 6, wherein the side surfaces of the component-loading pads are roughened.

8. The printed wiring board according to claim 1, wherein the uppermost resin insulation layer does not have a conductive circuit drawn from the component-loading pads toward a periphery of the plurality of resin insulation layers.

9. The printed wiring board according to claim 1, wherein the uppermost resin insulation layer has a pad-forming region in which the component-loading pads are positioned, and the roughened surface of the uppermost resin insulation layer has a portion which is exposed and is in a region excluding the pad-forming region.

10. The printed wiring board according to claim 1, further comprising a plurality of protective films formed on the top surfaces and side surfaces of the component-loading pads, respectively.

11. The printed wiring board according to claim 1, wherein the plurality of interlayer resin insulation layers includes at least one insulation layer containing a filling material and the filling material does not contain a glass cloth and long glass fibers.

12. The printed wiring board according to claim 1, further comprising at least one of an inner conductive circuit for power supply and an inner conductive circuit for ground, wherein the plurality of component-loading pads includes a plurality of power-supply component-loading pads and a plurality of ground component-loading pads, the plurality of component-loading pads is formed in a region in which at least one of the inner conductive circuit for power supply and the inner conductive circuit for ground is formed, the inner conductive circuit for power supply is electrically connected to the power-supply component-loading pads, and the inner conductive circuit for ground is electrically connect to the ground component-loading pads.

13. The printed wiring board according to claim 1, wherein the plurality of via conductors comprises a copper plated material filling a plurality of opening portions formed in the plurality of resin insulation layers, respectively.

14. The printed wiring board according to claim 1, wherein the plurality of via conductors comprises a plurality of a filled via conductors.

15. The printed wiring board according to claim 1, wherein the side surfaces of the component-loading pads are roughened.

16. A method for manufacturing a printed wiring board, comprising:

providing a metal foil having a roughened surface;

forming a resin insulation layer on the roughened surface of the metal foil;

forming an opening in the resin insulation layer;

forming a conductive circuit on the resin insulation layer;

forming in the opening a via conductor such that the conductive circuit is connected to the metal foil;

removing a portion of the metal foil from the resin insulation layer such that the resin insulation layer has a roughened surface imprinted by a removed portion of the roughened surface of the metal foil and an uppermost resin insulation layer comprising the resin insulation layer is formed; and

forming a component-loading pad configured to load an electronic component and comprising a remaining portion of the metal foil such that the component-load pad is formed on the roughened surface of the uppermost resin insulation layer and has a top surface and a side surface exposed over the roughened surface of the uppermost resin insulation layer and configured to mount a solder structure.

17. The method for manufacturing a printed wiring board according to claim 16, wherein the providing of the metal foil comprises securing the metal foil to a support board.

18. The method for manufacturing a printed wiring board according to claim 17, wherein the support board comprises a metal plate.

19. The method for manufacturing a printed wiring board according to claim 17, wherein the support board comprises a copper clad laminate.

20. The method for manufacturing a printed wiring board according to claim 16, wherein the forming of the conductive circuit and the forming of the via conductor are carried out simultaneously.