Neurophysiological dry sensor

• US 9,060,703 B2
• Filed: 07/18/2012
• Issued: 06/23/2015
• Est. Priority Date: 07/18/2012
• Status: Expired due to Fees

• Current Assignee: Neurotopia, Inc.
• Original Assignee: Neurotopia, Inc.
• Inventors: Dalke, Dale
• Primary Examiner(s): Cohen, Lee S
• Application Number:
  US13/551,917
• Publication Number:
  US 20140024912A1
• Time in Patent Office: 1,070 Days
• Field of Search: 600/383, 600/544
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]

Abstract

Preferably, an embodiment of a sensor assembly includes at least a sensor probe assembly providing a plurality of conductive pins, a compressible electrically conductive member in electrical communication with the sensor probe assembly, and a signal processing circuit in electrical communication with the compressible electrically conductive member. Preferably, the sensor assembly of the preferred embodiment further includes at least a housing confining said sensor probe assembly, compressible electrically conductive member, and signal processing circuit to form said sensor assembly.

Claims

1. A sensor assembly comprising;

a sensor probe assembly providing a plurality of conductive pins;

a compressible electrically conductive member in electrical communication with the sensor probe assembly;

a signal processing circuit in electrical communication with the compressible electrically conductive member; and

a housing confining said sensor probe assembly, and the compressible electrically conductive member, wherein the electrically conductive member is formed from a polymer filled with conductive particles, said signal processing circuit is confined by said housing, and in which said sensor probe assembly further provides a pin securement member cooperating in retention contact with the plurality of conductive pins.

2. The sensor assembly of claim 1, further comprising a rigid conductive member with a signal conductor affixed thereon, said rigid conductive member in pressing contact with said compressible electrically conductive member, and said signal conductor communicating signals from said plurality of conductive pins to said signal processing circuit.

3. The sensor assembly of claim 1, further comprising a standoff disposed between said signal processing circuit and said compressible electrically conductive member, said standoff providing a predetermined compressive load on said compressible electrically conductive member.

4. The sensor assembly of claim 1, further comprising a communication port interacting with said signal processing circuit and communicating information between said signal processing circuit and a brainwave processing system.

5. The sensor assembly of claim 1, wherein the conductive particles comprise carbon, and wherein the pin securement member is a flexible electrically conductive member of predetermined impedance when in the circuit cooperating with the plurality of conductive pins.

6. The sensor assembly of claim 1, in which the polymer is polyurethane.

7. The sensor assembly of claim 6, wherein the conductive particles comprise carbon.

8. The sensor assembly of claim 1, in which said housing comprises a component chamber cooperating with a confinement cover, said component chamber supporting said sensor probe assembly, and said compressible electrically conductive member, and said confinement cover confining said sensor probe assembly, and said compressible electrically conductive member.

9. The sensor assembly of claim 8, in which said component chamber comprising:

a confinement cover retention feature interacting with a retention member of the confinement cover;

a sensor probe assembly retention feature communicating with the sensor probe assembly to retain the sensor probe assembly in a predetermined position; and

a side wall disposed between said confinement cover retention feature and said sensor probe assembly retention feature, wherein said side wall provides a holding feature adjacent the confinement cover retention feature, said holding feature precluding an inadvertent removal of said compressible electrically conductive member and sensor probe assembly from communication with said sensor probe assembly retention feature.

10. The sensor assembly of claim 9, in which said confinement cover comprising:

the retention member interacting with the confinement cover retention feature to secure the component chamber adjacent stud confinement cover;

a signal processing circuit retention feature in pressing contact with said signal processing circuit; and

at least one connector pin communicating with the retention member and electrically interacting with the signal processing circuit.

11. The sensor assembly of claim 1, in which said signal processing circuit comprising:

a printed circuit member interacting with a standoff disposed between a signal processing circuit and said compressible electrically conductive member, said standoff providing a predetermined compressive load on said compressible electrically conductive member; and

a processor interacting with said primed circuit member, said processor receiving signals from said sensor probe assembly and communicating said signals to a brainwave processing system, in which said signal processing circuit is confined by said housing.

12. The sensor assembly of claim 11, in which the signal processing circuit further comprising:

differential amplifier interacting with said printed circuit member;

a reference signal communicating with said differential amplifier; and

a subject signal provided by said sensor probe assembly, when said sensor probe assembly is in electrical contact with a cranium of a subject, wherein said differential amplifier compares said reference signal to said subject signal and discards common signal patterns presented by said reference and subject signals to provide a native brainwave signal of the subject.

13. The sensor assembly of claim 12, in which the signal processing circuit further comprising:

an analog to digital converter with a digital signal processing core interacting with said differential amplifier and processing said native brainwave signal provided by said differential amplifier and outputting a digital signal representative of said native brainwave signal; and

an infinite impulse response filter interacting with said analog to digital converter to serve as a band pass filter for said digital signal.

14. The sensor assembly of claim 12, in which the signal processing circuit further comprising:

a memory communicating with said processor and storing a plurality of native brainwave signals; and

a communication port communicating with the memory and responsive to the processor for communicating native brainwave to the brainwave processing system.