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Implantable lead with a band stop filter having a capacitor in parallel with an inductor embedded in a dielectric body

  • US 9,061,139 B2
  • Filed: 10/31/2007
  • Issued: 06/23/2015
  • Est. Priority Date: 11/04/1998
  • Status: Expired due to Term
First Claim
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1. An implantable lead, comprising:

  • a) at least one lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

    b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

    i) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface of the dielectric body, the inner and outer surfaces meeting the first and second ends, wherein a bore defined by the inner surface extends through the dielectric body from the first end to the second end thereof,ii) first and second metallizations in contact with the respective first and second dielectric ends,iii) a capacitor comprising at least one active electrode plate extending from the first metallization partway along the dielectric length without meeting the second metallization, and at least one ground electrode plate extending from the second metallization partway along the dielectric length without meeting the first metallization, wherein the active and ground electrode plates are disposed within the inner and outer surfaces of the dielectric body, andiv) an inductor comprising at least one conductive inductor trace disposed within the dielectric body and in electrical continuity from the first metallization at the first end to the second metallization at the second end of the dielectric body, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.

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