Implantable lead with a band stop filter having a capacitor in parallel with an inductor embedded in a dielectric body

• US 9,061,139 B2
• Filed: 10/31/2007
• Issued: 06/23/2015
• Est. Priority Date: 11/04/1998
• Status: Expired due to Term

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Dabney, Warren S., Frysz, Christine A., Brendel, Richard L.
• Primary Examiner(s): Koharski, Christopher D
• Assistant Examiner(s): D ABREU, MICHAEL JOSEPH
• Application Number:
  US11/930,742
• Publication Number:
  US 20080049376A1
• Time in Patent Office: 2,792 Days
• Field of Search: 607/116, 607/122, 600/421
• US Class Current: 1/1
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H03H 2001/0042 Wound, ring or feed-through type capacitor
• CPC Class Codes: H03H 2001/005 Wound, ring or feed-through type inductor
• CPC Class Codes: H03H 7/1766 Parallel LC in series path H03H7/1783 takes precedence

Abstract

A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. In a preferred form, the TANK filter reduces or even eliminates the use of ferro-magnetic materials, and instead uses non-ferromagnetic materials so as to reduce or eliminate MRI image artifacts or the force or torque otherwise associated during an MRI image scan.

Claims

1. An implantable lead, comprising:

a) at least one lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

i) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface of the dielectric body, the inner and outer surfaces meeting the first and second ends, wherein a bore defined by the inner surface extends through the dielectric body from the first end to the second end thereof,

ii) first and second metallizations in contact with the respective first and second dielectric ends,

iii) a capacitor comprising at least one active electrode plate extending from the first metallization partway along the dielectric length without meeting the second metallization, and at least one ground electrode plate extending from the second metallization partway along the dielectric length without meeting the first metallization, wherein the active and ground electrode plates are disposed within the inner and outer surfaces of the dielectric body, and

iv) an inductor comprising at least one conductive inductor trace disposed within the dielectric body and in electrical continuity from the first metallization at the first end to the second metallization at the second end of the dielectric body, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.

2. The implantable lead of claim 1, wherein the band stop filter is disposed in, at, or adjacent to a distal tip electrode.

3. The implantable lead of claim 2, wherein the band stop filter is integrated into an active fixation TIP electrode.

4. The implantable lead of claim 3, wherein the band stop filter is integrated into a RING electrode.

5. The implantable lead of claim 1 wherein the band stop filter attenuates current flow through the lead wire over a range of RF MRI frequencies.

6. The implantable lead of claim 5, wherein the range of frequencies includes a plurality of RF MRI pulsed frequencies.

7. The implantable lead of claim 1, including an active fixation distal TIP electrode having a spline electrically connected to the lead wire and extending within a housing having a coiled helix TIP therein.

8. The implantable lead of claim 7, wherein the band stop filter is disposed within the housing and electrically connected to the spline and the coiled helix.

9. The implantable lead of claim 1, wherein at least one of the capacitor and the inductor comprises a precious metal or alloy thereof.

10. The implantable lead of claim 1, wherein the lead wire includes a plurality of band stop filters, each band stop filter having the at least one conductive active and ground electrode plates and the at least one conductive inductor trace comprised of conductive non-ferromagnetic material, and wherein each band stop filter attenuates current at a different RF MRI pulsed frequency.

11. The implantable lead of claim 1, wherein the band stop filter comprises a tubular capacitor electrically connected in parallel with the inductor, both the capacitor and the inductor being electrically connected to the lead wire at one of the first and second metallizations and to an electrode at or adjacent to the other of the first and second metallizations.

12. The implantable lead of claim 1, wherein the inductor of the band stop filter comprises a circuit trace having multiple turns extending from the first metallization to the second metallization.

13. The implantable lead of claim 1, wherein the capacitor has a plurality of active electrode plates extending from one of the first and second metallizations partway along the dielectric length without meeting the other metallization comprised of non-ferromagnetic material, and a plurality of ground electrode plates extending from the other of the first and second metallizations partway along the dielectric length without meeting the other metallization comprised of non-ferromagnetic material, the inductor being electrically connected to the first and second non-ferromagnetic metallizations in parallel with the capacitor.

14. The implantable lead of claim 1, wherein the inductor comprises a coiled circuit trace embedded in the dielectric material, wherein parasitic capacitances are formed between the adjacent coiled turns such that the bandstop filter comprises a self-resonant inductor.

15. The implantable lead of claim 1, wherein the band stop filter comprises a plurality of coiled conductive inductor traces configured to create parasitic capacitance between turns thereof, the inductor traces being electrically interconnected with one another.

16. The implantable lead of claim 1, wherein the band stop filter is hermetically sealed from body fluids.

17. The implantable lead of claim 1, wherein the band stop filter has an overall circuit Q wherein the resultant 3-dB bandwidth is at least 128 kHz.

18. The implantable lead of claim 1 wherein the active and ground electrode plates are at least partially cylindrically-shaped.

19. The implantable lead of claim 1 wherein the conductive inductor trace resides between the active and ground electrode plates and either the inner or the outer surface of the dielectric body.

20. The implantable lead of claim 1 wherein at least one conductive inductor trace resides between the active and ground electrode plates and both the inner and outer surfaces of the dielectric body.

21. The implantable lead of claim 1 wherein the dielectric thickness extends from a cylindrical inner dielectric surface to a cylindrical outer dielectric surface.

22. An implantable lead, comprising:

a) at least one implantable lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

i) a dielectric body having a tubular shape comprising a dielectric length extending from a proximal end to a distal end, and a dielectric thickness extending from an inner surface to an outer surface of the dielectric body, the inner and outer surfaces meeting the proximal and distal dielectric ends, wherein a bore extends through the dielectric body from the proximal end to the distal end thereof,

ii) inner and outer metallizations in contact with the respective inner and outer dielectric surfaces,

iii) a capacitor comprising at least one active electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, and at least one ground electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, or the capacitor comprising the at least one active electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, and the at least one ground electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, wherein the active and ground electrode plates are at an interior location in the dielectric length with respect to the proximal and distal dielectric ends, and

iv) an inductor comprising at least one conductive inductor trace extending in the dielectric thickness within the inner and outer dielectric surfaces and in electrical continuity from the inner metallization to the outer metallization, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the inner and outer metallizations contacting the respective inner and outer dielectric surfaces.

23. The implantable lead of claim 22 wherein a Q_L of the inductor is relatively maximized and a Q_C of the capacitor is relatively minimized to reduce an overall Q of the band stop filter.

24. The implantable lead of claim 23, wherein the Q_L of the inductor is relatively maximized by minimizing resistive loss associated with the inductor.

25. The implantable lead of claim 23, wherein the Q_C of the capacitor is relatively minimized by raising equivalent series resistance associated with the capacitor.

26. The implantable lead of claim 25, wherein the equivalent series resistance of the capacitor is raised by at least one of the group consisting of:

a) reducing thickness of electrode plates in the capacitor;

b) using high resistivity capacitor electrode materials;

c) adding dielectric powders to electrode ink;

d) providing apertures, gaps, slits or spokes in the electrode plates of the capacitor;

e) providing separate discrete resistors in series with the capacitor;

f) utilizing resistive electrical attachment materials to the capacitor; and

g) utilizing capacitor dielectric materials that have high dielectric loss tangents at the selected frequency.

27. The implantable lead of claim 22 wherein the band stop filter attenuates current flow through the lead wire over a range of RF MRI frequencies.

28. The implantable lead of claim 27 wherein the range of frequencies includes a plurality of RF MRI pulsed frequencies.

29. The implantable lead of claim 22 wherein the band stop filter has an overall circuit Q wherein the resultant 3-dB bandwidth is at least 128 kHz.

30. The implantable lead of claim 22 wherein the active and ground electrode plates have planar annular shapes.

31. The implantable lead of claim 22 wherein the conductive inductor trace resides between the active and ground electrode plates and either the proximal or the distal end of the dielectric body.

32. The implantable lead of claim 22 wherein at least one conductive inductor trace resides between the active and ground electrode plates and both the proximal and distal ends of the dielectric body.

33. The implantable lead of claim 22 wherein the band stop filter comprises a plurality of coiled conductive inductor traces configured to create parasitic capacitance between turns thereof, the inductor traces being electrically interconnected with one another.

34. The implantable lead of claim 22 wherein the dielectric thickness extends from a cylindrical inner surface to a cylindrical outer surface of the dielectric body.

35. A band stop filter, comprising:

a) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface, the inner and outer surfaces meeting the first and second ends of the dielectric body, wherein a bore extends through the dielectric body from the first end to the second end thereof,

b) first and second metallizations in contact with the respective first and second dielectric ends,

c) a capacitor comprising at least one active plate extending from the first metallization partway along the dielectric length without meeting the second metallization, and at least one ground electrode plate extending from the second metallization partway along the dielectric length without meeting the second metallization, wherein the active and ground electrode plates are at an interior location in the dielectric thickness with respect to the inner and outer dielectric surfaces, and

d) an inductor comprising at least one conductive inductor trace extending in the dielectric thickness between the inner and outer dielectric surfaces and in electrical continuity from the first metallization at the first dielectric end to the second metallization at the second dielectric end, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.

36. The band stop filter of claim 35 wherein the active and ground electrode plates are at least partially cylindrically-shaped.

37. The band stop filter of claim 35 wherein the conductive inductor trace resides between the active and ground electrode plates and either the inner or the outer surface of the dielectric body.

38. The band stop filter of claim 35 wherein at least one conductive inductor trace resides between the active and ground electrode plates and both the inner and outer surfaces of the dielectric body.

39. A band stop filter, comprising:

a) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface, the inner and outer surfaces meeting the proximal and distal ends of the dielectric body, wherein a bore extends through the dielectric body from the first end to the second end thereof,

b) inner and outer metallizations in contact with the respective inner and outer dielectric surfaces,

c) a capacitor comprising at least one active electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, and at least one ground electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, wherein the active and ground electrode plates are at an interior location in the dielectric length with respect to the first and second dielectric ends, and

d) an inductor comprising at least one conductive inductor trace extending in the dielectric thickness between the inner and outer surfaces thereof and in electrical continuity from the inner metallization to the outer metallization, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.

40. The band stop filter of claim 39 wherein the active and ground electrode plates have planar annular shapes.

41. The band stop filter of claim 39 wherein the conductive inductor trace resides between the active and ground electrode plates and either the proximal or the distal end of the dielectric body.

42. The band stop filter of claim 39 wherein at least one conductive inductor trace resides between the active and ground electrode plates and both the proximal and distal ends of the dielectric body.

43. An implantable lead, comprising:

a) at least one lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

i) a dielectric body having a tubular shape comprising a dielectric length extending from a first dielectric end to a second dielectric end, and a dielectric thickness extending from an inner dielectric surface to an outer dielectric surface of the dielectric body, the inner and outer dielectric surfaces meeting the first and second dielectric ends, wherein a bore extends through the dielectric body from the first end to the second end thereof,

ii) first and second metallizations in contact with the respective first and second dielectric ends,

iii) a capacitor comprising at least one active plate extending from the first metallization partway along the dielectric length without meeting the second metallization, and at least one ground electrode plate extending from the second metallization partway along the dielectric length without meeting the first metallization, wherein the active and ground electrode plates are at an interior location in the dielectric thickness with respect to the inner and outer dielectric surfaces, and

iv) an inductor comprising at least one conductive inductor trace supported on at least one of the inner and outer dielectric surfaces and in electrical continuity from the first metallization at the first dielectric end to the second metallization at the second dielectric end, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.

44. An implantable lead, comprising:

a) at least one implantable lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

i) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface, the inner and outer surfaces meeting the proximal and distal ends of the dielectric body, wherein a bore extends through the dielectric body from the proximal end to the distal end thereof,

ii) inner and outer metallizations in contact with the respective inner and outer dielectric surfaces,

iii) a capacitor comprising at least one active electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, and at least one ground electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, or the capacitor comprising the at least one active electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, and the at least one ground electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization,

wherein the active and ground electrode plates are at an interior location in the dielectric length with respect to the first and second dielectric ends, and

iv) an inductor comprising at least one conductive inductor trace supported on at least one of the first and second dielectric surfaces and in electrical continuity from the inner metallization to the outer metallization, the inductor being spaced from the active and ground electrode plates to thereby provide the inductor and capacitor electrically connected in parallel between the inner and outer metallizations contacting the respective inner and outer dielectric surfaces.

45. An implantable lead, comprising:

a) at least one lead wire having a length extending from a proximal end to a distal end, wherein the proximal end of the lead wire is electrically connectable to a medical device and the distal end is contactable with biological cells; and

b) at least one band stop filter in series with the lead wire somewhere along the length thereof, wherein the band stop filter comprises;

i) a dielectric body having a tubular shape comprising a dielectric length extending from a first end to a second end, and a dielectric thickness extending from an inner surface to an outer surface, the inner and outer surfaces meeting the proximal and distal ends of the dielectric body, wherein a bore extends through the dielectric body from the first end to the second end thereof,

ii) proximal and distal metallizations in contact with the respective proximal and distal dielectric ends,

iii) a capacitor comprising at least one active electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, and at least one ground electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, or the capacitor comprising the at least one active electrode plate extending from the outer metallization partway along the dielectric thickness without meeting the inner metallization, and the at least one ground electrode plate extending from the inner metallization partway along the dielectric thickness without meeting the outer metallization, wherein the active and ground electrode plates are at an interior location in the dielectric length with respect to the proximal and distal dielectric ends, and

iv) at least one conductive trace coiling around the bore in the dielectric thickness between the inner and outer dielectric surfaces and in electrical continuity from the first metallization at the first dielectric end to the second metallization at the second dielectric end to thereby provide the inductor and capacitor electrically connected in parallel between the first and second metallizations contacting the respective first and second dielectric ends.