Capacitive filtered feedthrough array for implantable medical device

• US 9,061,161 B2
• Filed: 08/28/2012
• Issued: 06/23/2015
• Est. Priority Date: 09/01/2011
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Iyer, Rajesh V., Miltich, Thomas P., Munns, Gordon O., Goldman, Simon E.
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): PATEL, RAKESH BHASKARBHAI
• Application Number:
  US13/596,944
• Publication Number:
  US 20130127567A1
• Time in Patent Office: 1,029 Days
• Field of Search: 333/182
• US Class Current: 1/1
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: A61N 1/3968 Constructional arrangements, e.g. casings A61N1/375 takes precedence
• CPC Class Codes: H03H 2001/0042 Wound, ring or feed-through type capacitor
• CPC Class Codes: H03H 7/0138 Electrical filters or coupling circuits
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

In one example, a filtered feedthrough assembly for a medical device, such as, e.g., an implantable medical device, is described. The filtered feedthrough assembly may comprise a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side; a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter substantially surrounding at least a portion the at least one filter array conductive pathway; and at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.

Claims

1. A filtered feedthrough assembly comprising:

a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side;

a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter of the capacitor filter array substantially surrounding at least a portion of the at least one filter array conductive pathway, wherein the at least one filter array conductive pathway comprises a termination plug including an electrically conductive material substantially filling a portion of a via extending between the first filter array side and the second filter array side; and

at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway, wherein the at least one electrically conductive member comprises an alignment portion configured to mate with the via so as to align the at least one feedthrough conductive pathway with the at least one filter array conductive pathway.

2. The filtered feedthrough assembly of claim 1, wherein the at least one electrically conductive member comprises at least one solder joint mechanically coupling and electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.

3. The filtered feedthrough assembly of claim 2, wherein the at least one solder joint comprises at least one of an indium-silver alloy, a tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, and gold-tin alloy.

4. The filtered feedthrough assembly of claim 2, wherein the at least one solder joint is formed by melting a solder preform.

5. The filtered feedthrough assembly of claim 1,

wherein:

the at least one feedthrough conductive pathway comprises a plurality of feedthrough conductive pathways extending between the first feedthrough side and the second feedthrough side;

the at least one filter array conductive pathway comprises a plurality of filter array conductive pathways extending between the first array side and the second array side, the at least one capacitive filter comprises a plurality of capacitor filters each substantially surrounding at least a portion of a corresponding one of the plurality of filter array conductive pathways; and

the at least one electrically conductive member comprises a plurality of electrically conductive members, each electrically conductive member electrically coupling one of the plurality of filter array conductive pathways to a corresponding one of the plurality of feedthrough conductive pathways.

6. The filtered feedthrough assembly of claim 1, wherein the at least one electrically conductive member comprises at least one of a coiled spring connector, spring-loaded contact connector, conductive epoxy, conductive polymer, scraping contact, or fuzz button interconnect.

7. The filtered feedthrough assembly of claim 1, wherein the termination plug comprises at least one of silver, palladium, platinum, gold, nickel, and alloys thereof.

8. The filtered feedthrough assembly of claim 1, wherein the at least one feedthrough conductive pathway comprises a second via and a connection pad electrically coupled to the second via at the first feedthrough side, wherein the at least one electrically conductive member is bonded to the connection pad.

9. The filtered feedthrough assembly of claim 1, further comprising a ferrule defining a ferrule opening, wherein the feedthrough extends through the ferrule opening and a hermetic seal is formed between the feedthrough and the ferrule.

10. The filtered feedthrough assembly of claim 1, wherein the feedthrough comprises a cofired ceramic substrate.

11. The filtered feedthrough assembly of claim 10, wherein the cofired ceramic substrate comprises a high-temperature cofired ceramic (HTCC) material.

12. An implantable medical device comprising:

a housing;

electronics enclosed within the housing;

a ferrule mounted within an opening in the housing, the ferrule comprising a ferrule opening extending between an internally-facing ferrule side and an externally-facing ferrule side;

a feedthrough mounted in the ferrule opening, wherein a hermetic seal is formed between the feedthrough and the ferrule, the feedthrough comprising at least one feedthrough conductive pathway extending through the feedthrough between an internally-facing feedthrough side and an externally-facing feedthrough side;

a capacitive filter array comprising at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side, and at least one capacitor filter of the capacitive filter array substantially surrounding at least a portion of the at least one filter array conductive pathway;

at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway, wherein the at least one electrically conductive member comprises a coiled spring formed of an electrically conductive material.

13. A filtered feedthrough assembly comprising:

a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side;

a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter of the capacitor filter array substantially surrounding at least a portion of the at least one filter array conductive pathway; and

at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway, wherein the at least one electrically conductive member comprises a coiled spring formed of an electrically conductive material.

14. An implantable medical device comprising:

a housing;

electronics enclosed within the housing;

a ferrule mounted within an opening in the housing, the ferrule comprising a ferrule opening extending between an internally-facing ferrule side and an externally-facing ferrule side;

a feedthrough mounted in the ferrule opening, wherein a hermetic seal is formed between the feedthrough and the ferrule, the feedthrough comprising at least one feedthrough conductive pathway extending through the feedthrough between an internally-facing feedthrough side and an externally-facing feedthrough side;

a capacitive filter array comprising at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side, at least one capacitor filter of the capacitive filter array substantially surrounding at least a portion of the at least one filter array conductive pathway, wherein the at least one filter array conductive pathway comprises a termination plug including an electrically conductive material substantially filling a portion of a via extending between the internally-facing filter array side and the externally-facing filter array side;

at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway, wherein the at least one electrically conductive member comprises an alignment portion configured to mate with the via so as to align the at least one feedthrough conductive pathway with the at least one filter array conductive pathway.

15. The implantable medical device of claim 14, wherein the at least one electrically conductive member comprises at least one solder joint mechanically coupling and electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.

16. The implantable medical device of claim 15, wherein the at least one solder joint comprises at least one of an indium-silver alloy, a tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, and gold-tin alloy.

17. The implantable medical device of claim 15, wherein the at least one solder joint is formed by melting a solder preform.

18. The implantable medical device of claim 14, wherein:

the at least one feedthrough conductive pathway comprises a plurality of feedthrough conductive pathways extending between the internally-facing feedthrough side and the externally-facing feedthrough side;

the at least one filter array conductive pathway comprises a plurality of filter array conductive pathways extending between the internally-facing array side and the externally-facing array side, the at least one capacitive filter array comprises a plurality of capacitor filters each substantially surrounding at least a portion of a corresponding one of the plurality of filter array conductive pathways; and

the at least one electrically conductive member comprises a plurality of electrically conductive members, each electrically conductive member electrically coupling one of the plurality of filter array conductive pathways to a corresponding one of the plurality of feedthrough conductive pathways.

19. The implantable medical device of claim 14, wherein the at least one electrically conductive member comprises at least one of a coiled spring connector, spring-loaded contact connector, conductive epoxy, conductive polymer, scraping contact, or fuzz button interconnect.

20. The implantable medical device of claim 14, wherein the termination material of the termination plug comprises at least one of silver, palladium, platinum, gold, nickel, and alloys thereof.

21. The implantable medical device of claim 14, wherein the at least one feedthrough conductive pathway comprises a second via and a connection pad electrically coupled to the second via at the internally-facing feedthrough side, wherein the at least one electrically conductive member is bonded to the connection pad.

22. The implantable medical device of claim 14, wherein the ferrule further comprises a mounting flange, the ferrule configured to be welded to the housing at the mounting flange.

23. The implantable medical device of claim 14, wherein the hermetic seal between the feedthrough and the ferrule comprises a braze joint between the feedthrough and the ferrule.

24. The implantable medical device of claim 14, wherein the feedthrough comprises a cofired ceramic substrate.

25. The implantable medical device of claim 24, wherein the cofired ceramic substrate comprises a high temperature cofired ceramic (HTCC) material.

26. The implantable medical device of claim 14, wherein the capacitive filter array comprises a ceramic capacitive filter substrate, wherein the at least one filter array conductive pathway extends through the ceramic capacitive filter substrate between an internally-facing filter substrate side and a generally opposed externally-facing filter substrate side.

27. A method comprising electrically coupling at least one feedthrough conductive pathway of a feedthrough to at least one filter array conductive pathway of a capacitive filter array via at least one electrically conductive member, wherein the at least one feedthrough conductive pathway extends between a first feedthrough side and a second feedthrough side, and wherein the at least one filter array conductive pathway extends between a first filter array side and a second filter array side, and the capacitive filter array comprises at least one capacitor filter substantially surrounding at least a portion of the at least one filter array conductive pathway, wherein the at least one electrically conductive member comprises a coiled spring formed of an electrically conductive material.

28. The method of claim 27, wherein that at least one electrically conductive member comprises at least one of a coiled spring connector, spring-loaded contact connector, conductive epoxy, conductive polymer, scraping contact, or fuzz button interconnect.

29. The method of claim 27, further comprising electrically coupling the at least one filter array conductive pathway to electronics within a housing of an electronics device.

30. The method of claim 27, wherein the at least one electrically conductive member comprises at least one solder joint, wherein the electrically coupling of the at least one filter array conductive pathway to the at least one feedthrough conductive pathway via the electrically conductive member comprises forming at least one solder joint between the at least one feedthrough conductive pathway of the feedthrough and the at least one filter array conductive pathway of the capacitive filter array.

31. The method of claim 30, wherein the at least one solder joint comprises at least one of an indium-silver alloy, a tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, and gold-tin alloy.

32. The method of claim 30, wherein forming the at least one solder joint comprises:

positioning a solder preform between the at least one feedthrough conductive pathway and the corresponding at least one filter array conductive pathway;

melting the solder preform to form the at least one solder joint between the at least one feedthrough conductive pathway and the corresponding at least one filter array conductive pathway.

33. The method of claim 27, wherein:

the feedthrough comprises a feedthrough substrate with the at least one feedthrough conductive pathway extending through the feedthrough substrate; and

the capacitive filter array comprises a capacitive filter substrate with the at least one filter array conductive pathway extending between a first filter substrate side and a second filter substrate side, and at least one capacitor filter of the capacitive filter array substantially surrounding at least a portion of the at least one filter array conductive pathway.

34. The method of claim 27, further comprising mounting the feedthrough within an opening in a ferrule.

35. The method of claim 34, further comprising forming a hermetic seal between the feedthrough and the ferrule.

36. The method of claim 34, further comprising mounting the ferrule within a housing of an electronics device.

37. The method of claim 36, further comprising forming a second hermetic seal between the ferrule and the housing.

38. The method of claim 27, further comprising grounding the capacitive filter array.

39. The method of claim 27, further comprising electrically coupling the at least one feedthrough conductive pathway to a corresponding conductor for an implantable medical device.